Incorporating a cable lock option, the 62674 series of 0.5mm pitch vertical connectors from FCI provides a high cable retention force for flexible printed circuits. Preheld by the connector's compact slider mechanism, cables are easily mated in a ze
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Titanium material sheet for PCB wave soldering pallet Model: TA1 Thickness: 1-12mm Sheet size: can be customized Wall thickness less than 0.5mm Component spacing less than 0.5mm Properties of Titanium material: Titanium is a new type of metal with
Partial List of Services • single/double Multi-layer (up to 30) • SMT & Through-hole • Quick-turn Prototypes • Production Quantities with Scheduled Deliveries • Blind Via • Buried Via • 0.5mm pitch • IPC Standards • 24-hour multi-layer quick-tur
New Equipment | Solder Materials
We have a wide variety of flux-Cored solder, a mix of metal alloy, flux and other elements, that we have put together to match every type of application. This formula is designed so that the incidence of bridging is rare; likew
New Equipment | Board Handling - Conveyors
With AOI and TEST becoming a process necessity, PROMATION has manufactured several systems that can sort PASS/FAIL criteria, passing the good product through the station and buffering failed inspection products into a magazine. Our ESM-100 station
New Equipment | Solder Paste Stencils
EasyBraid’s stencil rolls are designed for use in SMT screen printing lines which keep stencil apertures clear of paste residues during the automatic screen printing process. They also clean the bottom of stencils, keeping them free from paste and fl
New Equipment | Solder Paste Stencils
Through the increase of mixed technologies, stepped stencils have gained importance to the electronic assembly manufacturer. If the solder paste quantity can no longer be adequately regulated by adjusting Step/Relief Stencil Picture the pad sizes, st
New Equipment | Solder Paste Stencils
Stentech is at the forefront of the next generation of stencils, Electroformed Stencils, with more than ten years of research and development. Stentech has now been manufacturing quality Electroformed Stencils for over five years for our North Americ
For flip chip attachment or electrical grounding ACP's for Electrical Interconnection Zymet's ACP’s designed for electrical interconnection are used for flip chip attachment. Applications include chip-on-glass (COG) attachment of driver IC's and
TP300 is the simplest solution, the most compact-size and lowest-cost solder paste printer, it can be easy and accurate to print the solder paste on any board. Please see details below: 1). It is suitable for both single-sided and double-sided p
