Process Capability: Several professional auto Siemens series Siplace SMT placement and the plated-through-hole(PTH) insertion parts, test, package lines Productivity: mount above 1.5million/day SMC components in our SMT production lines Small SMC/
Process Capability: Several professional auto Siemens series Siplace SMT placement and the plated-through-hole(PTH) insertion parts, test, package lines Productivity: mount above 1.5million/day SMC components in our SMT production lines Small SMC/
TP45N can release all SMD units including 0201 ,SOIC PLCC BGA to QFPIC(o.5mm foot spacing) ��Automatic centering system: The 4 side claws can fit for all SMD component like 0402, SOIC, PLCC��QFP IC�� ��High precision pole system ��Vision centering s
A.High precision. Multi-function. It satisfies all welding requirements of 0201 resistance and capacitance, fine spacing QFP, SOP, PLCC, BGA,CSP and so on. It meets the requirements of small batch and multimode product. It is also suitable for labora
A. High precision. Multi-function. It satisfies all welding requirements of 0201 resistance and capacitance, fine spacing QFP, SOP, PLCC, BGA,CSP and so on. It meets the requirements of small batch and multimode product. It is also suitable for labor
Yamaha CL 8*2mm Feeders for 0201 Yamaha CL 8*2mm Feeders for 0402 Yamaha CL 8*4mm Feeders Yamaha CL 12mm Feeders Yamaha CL 16mm Feeders Yamaha CL 24mm Feeders Yamaha CL 32mm Feeders Yamaha CL 44mm Feeders Yam
Our Assembly factory could perform reliable manufacturing services for : Surface Mount PCB assembly ; Through hole assembly ; 0201 to 44mm2 - BGA, micro BGA, CSP, fine pitch QFP ; Automated pick and place ; Placement rate - 24,000 cph; Hand build ;
Our Assembly factory could perform reliable manufacturing services for : Surface Mount PCB assembly ; Through hole assembly ; 0201 to 44mm2 - BGA, micro BGA, CSP, fine pitch QFP ; Automated pick and place ; Placement rate - 24,000 cph ; Hand build ;
New Equipment | Rework & Repair Equipment
Cost Effective Rework of Medium Size Boards The FINEPLACER® coreplus is a compact, yet versatile rework system that offers a level of professionalism that exceeds its attractive price. The system offers proven rework technology for a wide spectrum
New Equipment | Solder Materials
Solves: QFN Voiding | Head-in-Pillow | Graping Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by t
