New SMT Equipment: 0201 reflow (Page 1 of 2)

SMT Assembly Middle Size Hot Air Lead Free Reflow Oven

SMT Assembly Middle Size Hot Air Lead Free Reflow Oven

New Equipment | Reflow

Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Full Hot Air Lead-Free Reflow Oven with PLC A800

Full Hot Air Lead-Free Reflow Oven with PLC A800

New Equipment | Reflow

Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated

I.C.T ( Dongguan ICT Technology Co., Ltd. )

TR360 benchtop reflow oven

TR360 benchtop reflow oven

New Equipment | Reflow

 TR360 is the simplest solution, the most compact-size and cost-efficient reflow oven, but it is functional over your expectation,  fully like the large full-size reflow oven. Please see details below: 1). It is suitable for both leaded and lead-fr

Tripper Technology Limited

Intelligent lead-free Reflow OvenT200C

Intelligent lead-free Reflow OvenT200C

New Equipment |  

A.High precision. Multi-function. It satisfies all welding requirements of 0201 resistance and capacitance, fine spacing QFP, SOP, PLCC, BGA,CSP and so on. It meets the requirements of small batch and multimode product. It is also suitable for labora

Beijing Technology Company

Lead-free Reflow Oven T200A

Lead-free Reflow Oven T200A

New Equipment |  

A. High precision. Multi-function. It satisfies all welding requirements of 0201 resistance and capacitance, fine spacing QFP, SOP, PLCC, BGA,CSP and so on. It meets the requirements of small batch and multimode product. It is also suitable for labor

Beijing Technology Company

Indium8.9 Pb-Free Solder Paste

Indium8.9 Pb-Free Solder Paste

New Equipment | Solder Materials

Solves: QFN Voiding | Head-in-Pillow | Graping Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by t

Indium Corporation

Electronics Manufacturing

New Equipment |  

9 SMT Assembly Lines Total placement capability 150,000 components/hr Fine pitch placement up to 12mil Component Ranges: 0201 to BGA and uBGA up to 55mm square 40 microns placement accuracy with 4 sigma capability RoHS Compliant Lines with N2 envi

SFO Technologies Pvt Ltd

PCB PCBA

PCB PCBA

New Equipment |  

PCBA(RoHS-Compliance,Lead free,ODM,OEM,SMT,EMS) We supply OEM and ODM services for PCBA. 1) Surface-mounting Technology (SMT) and Through-hole/DIP 2) 0402,0201 placement 3) BGA,CSP,QFP 4) IC precision: 0.3mm 5) AOI,X-Ray,ICT(In circuit test),FC

Tronixlink PCB PCBA

Bob Willis On Site Theory or Hands On Workshops

Bob Willis On Site Theory or Hands On Workshops

New Equipment | Education/Training

All Bob Willis training workshops are run on site at your manufacturing facility, conference or exhibition venues Worldwide. We offer the largest range of theory and hands on workshops in the industry. The content of any workshop may be modified to s

ASKbobwillis.com

SACM™ Soldering Alloy

SACM™ Soldering Alloy

New Equipment | Solder Materials

Superior Drop Shock Performance AND Thermal Cycling Reliability Current Industry Dilemma The standard set of Pb-free alloys has a dramatic trade-off between thermal cycling and drop testing. Additionally, all these SAC alloys are far inferior to

Indium Corporation

  1 2 Next

0201 reflow searches for Companies, Equipment, Machines, Suppliers & Information