SAMSUNG CN750 NOZZLE Model: SAMSUNG CN750 Nozzle SAMSUNG Nozzle List Brand Machine Model Specification Material of nozzle tip SAMSUNG CP30 M1, M2 , M3 Tungsten steel SAMSUNG CP33 XG05 / XH08 / XI14 / AA24 / BA40 Tungsten steel SAMSUNG CP40 N04
SAMSUNG CN400N Nozzle Model: SAMSUNG CN400N Nozzle SAMSUNG Nozzle List Brand Machine Model Specification Material of nozzle tip SAMSUNG CP30 M1, M2 , M3 Tungsten steel SAMSUNG CP33 XG05 / XH08 / XI14 / AA24 / BA40 Tungsten steel SAMSUNG CP40 N
6AG40110CA211JX0 6AG40110CA311XX0 6AG40111CA211JX0 6AG40112CA121JX0 6AG40112DA111JX0 6AG40400AE200AA0 6AG40700BA000XA0 6AG40700EA000AA0 6AV35911AD001AB0 6AV36075BA000AK0 6AV36075BB000AF0 6AV36075BB000AG0 6AV36075BB000AH0 6AV36075BC001AH0 6AV36075CB00
New Equipment | Solder Materials
1.00” (25.4mm) +/-0.040” (1.010mm) Thickness Error 0.001” (0.025mm) +/-0.0002” (0.0050mm) 0.0010” - 0.002” (0.025mm-0.050mm) +/-0.0003” (0.0076mm)
Heller Model 1800 W Date of manufacturing: October, 1998 Hours Run: 22,050 MACHINE DETAILS:: Machine Serial Number: 1098D1-21219 Machine Software Version: Heller Win Machine Working Hours: 22,050 Machine Color: White Forced convection type of
Available on 2mm, 0.8mm and 0.50" centers in various contact configurations and heights they are useful for PCB stacking applications.
Our double-ended sockets addresses the limitations of fixture wiring by eliminating the wire. Available in .100", .075 and .050" center spacing.
Product number:CP03-C Humidity Range:1~99%RH ; 0~50。C Dimension: 68x45x25(mm) Accuracy:±3%RH(1%~80%RH) ; ±1。C(at25。C) Resolution: 1%RH ; 1。C Operating temp: 0~50。C Sensor drift:≦0.25 (%RH/yr) ; ≦0.05(。C/yr) Battery type: 2 pieces AAA battery
New Equipment | Solder Materials
90% on area ratios of 0.50 and a stencil life >8 hours. H10’s powerful wetting characteristics eliminate NWO (HiP) defects and improve pad coverage on all surface finishes. H10 reduces voiding on BGA, BTC and LGA and offers enhanced electrochemical r
New Equipment | Solder Materials
Solder Preforms offers accurate solder deposition for various soldering processes. Reel packaging provides opportunity of automation for efficient application. Custom Material may be formulated to unique material and dimensional requirements. Specif
