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Materials: FR4 ,Aluminium,FPC layer: 1-12 Board thickness: 0.4-4.2mm Copper:0.5-3oz Finishing: Plating gold,immersion gold,immersion silver,Pb free HAL,OSP, Min.hole size: 0.10mm(Blind and burried hole available) Min. Line/Space: 0.10mm/0.10mm The
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Lead Free 4 Top 4 Bottom plus 1 cooling zone Vintage: 2003 Specs: Substrate size(min/max): L100xW25mm/ L250xW75mm Substrate Height : 10mm max (upper) Transfer method : wire belt conveyor method Transfer height : 900 A+/- 20
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