New SMT Equipment: 10-layer (Page 1 of 2)

Rigid-flex PCB, Rigid flex circuit board manufacturer, Flex rigid PCB -- Hitech Circuits Co., Limited

Rigid-flex PCB, Rigid flex circuit board manufacturer, Flex rigid PCB -- Hitech Circuits Co., Limited

New Equipment | Fabrication Services

Rigid flex printed circuit boards (PCBs) are manufactured by combining rigid and flexible board technologies. These circuit boards are made up of multiple flexible circuit inner layers. An epoxy pre-preg bonding film is used to attach together these

Hitech Circuits Co., Limited

HASL-Red-Solder-PCB-10Layers-Gold-Finger

HASL-Red-Solder-PCB-10Layers-Gold-Finger

New Equipment |  

FR-4 Material 2.4 mm Thickness 4 Layers Lead Free Surface Treatment Red Solder Mask Gold Finger

Shenzhen Longkun Technology Co.,Ltd

10 Layer Gold fingers PCB

10 Layer Gold fingers PCB

New Equipment | Components

Layer: 10L Base Material:FR-4 tg180(ITEQ) Board Thickness: 1.6mm Final copper: 35um Surface Finish:Immersion Gold/Au:2u” min. Gold fingers/Au:30u” Solder mask: Green Profile: Routing E-test: 100% Fixture Quality report: Solderability test, Fi

Headpcb

10 layers HDI PCB prototype blind and buried holes board(2+6+2)huanyupcb.com

10 layers HDI PCB prototype blind and buried holes board(2+6+2)huanyupcb.com

New Equipment | Prototyping

Quickturn PCB quote please sent E-mail to quotes@huanyupcb.com.  HDI (High Density Intrerconnection) is defined as substrate or board with the Microvia of aperture below 6mil, hole pad below 0.25mm, connect pad density above 130 points / square inch

PCB Manufacturer HuanYu Technologies Co., Ltd.

PCB

PCB

New Equipment | Assembly Services

As an one-stop service provider of PCB, Sophic is especially specialized in medium volume to mass production of 2-10 layers rigid board. Sophic has been certified by ISO9001, UL and TS16949.

Shenzhen Sophic Industrial Co.,Ltd

FUJI Mounter machine

FUJI Mounter machine

New Equipment | Pick & Place

Electronic board size: maximum: 457*356mm; minimum: 50*50mm Electronic board thickness: 0.3 - 4.0mm Component type: front side: the largest 40 species; rear side: 10 kinds of 10 layers / 20 kinds of 10 layers Board loading time: 4.2 seconds Mount

Shenzhen Maxsharer Technology Co., Ltd

10L-3oz-Base-pcb

10L-3oz-Base-pcb

New Equipment |  

FR-4 Material 2. 4 mm Thickness 3OZ base Cu 10 Layers Immersion Gold Surface Treatment Green Solder Mask

Shenzhen Longkun Technology Co.,Ltd

TX-3

TX-3

New Equipment | Materials

Materials: FR-4 Copper Thickness: 1 oz Layer Count: 10layer, 1.6 mm Min. Hole Size: 10 mil Min.Line Width/Space: 5 mil Finishing: Immersion Gold

Zhuhai Camtech Circuit Co., Ltd

Via-in-Pad

Via-in-Pad

New Equipment | Assembly Services

10-Layer Via-in-Pad Technology PCB features blind via in L9-10 in addition to the Fine Pitch BGA. Putting the via in the pad creates space on the external layers for more routing and avoids potential shorts during assembly. The routing channel widt

Saturn Electronics Corporation

Quick turn PCB Prototypes

Quick turn PCB Prototypes

New Equipment | Components

1). Size: 45*140mm/1 up 2). Layer count: 2 Layer, 20 μm PTH 3). Thickness: 1.6mm +/- 10% 4). Copper weight(Finished): 35 μm 5). SMOBC: LPI Green solder mask/ White legend 6). Holes: 0.4mm minimum, 4/4 mil track/space 7). Pads finish: HASL 8).

Bicheng Enterprise Company

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2024 Eptac IPC Certification Training Schedule

High Throughput Reflow Oven
2024 Eptac IPC Certification Training Schedule

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Best SMT Reflow Oven

Best Reflow Oven


500+ original new CF081CR CN081CR FEEDER in stock