New SMT Equipment: 100 micron (Page 1 of 4)

SE500ULTRA™ High-Speed 3D SPI

SE500ULTRA™ High-Speed 3D SPI

New Equipment | Inspection

World-Class Accuracy At Fastest Speed. The SE500ULTRA™ system is power-packed with 30% more speed, newly designed V5 series software enabling world class user experience and optional dual illumination sensor. An all-new, improved ultrafast sensor c

CyberOptics Corporation

Mask Alinger - Lithopack300

Mask Alinger - Lithopack300

New Equipment |  

SUSS MicroTec's newest product offering is a 300 mm lithography cluster which consists of an MA300 mask aligner module linked to an ACS300 spin-coating system. LithoPack300 (LP300) is specifically designed for wafer bumping and wafer level packaging

SUSS MicroTec AG

CAT90-SA Semi Automatic Pick and Place System

CAT90-SA Semi Automatic Pick and Place System

New Equipment | Pick & Place

The CAT90-SA pick and place systems are semi-automatic machines featuring software guidance and the latest high resolution vision technology. Systems are designed for placement of various SMT components such as capacitors, resistors, SOIC’s, fine-pit

Advanced Techniques US Inc. (ATCO)

Machvision 3D Profiler

Machvision 3D Profiler

New Equipment | Software

The 3D Profiler is an automatic machine to measure the dent of the copper filled vias. The system offers the opportunity for 100% inspection to ensure the yield of the copper filling with inspection speeds of 5 minutes per panel and +/- 2 micron accu

Christopher Associates Inc.

Eclipse Industries

New Equipment |  

Eclipse Industries DS-107 Aligner Bonder The DS-107 Aligner Bonder is an ultra-high precision, high or low force aligner bonder. Constructed on a granite platform for superior stability and rigidity, the DS-107 is designed for alignment accuracy of

Eclipse Industries

LINX

New Equipment |  

The Linx is a breakthrough in cost effective x-ray inspection and an effective means of process evaluation. This compact system is suited to a broad range of applications including BGA, flip chip, PCB layer alignment and ge

X-Tek LLC

CyberGage360™ 3D Scanning System

CyberGage360™ 3D Scanning System

New Equipment | Inspection

Unprecedented combination of speed, accuracy and one-button simplicity for non-contact automated 3D scanning inspection. Dramatically Speeds Up Quality Assurance of Incoming Parts Inspection & In-Process Inspection of components on the manufacturing

CyberOptics Corporation

BTX-208 Portable Tip Extraction System

BTX-208 Portable Tip Extraction System

New Equipment | Fume Extraction

The BTX-208 Fume Extraction System is a tip extraction unit with a high vacuum blower motor and a capacity for up to eight workstations. Features and Benefits: High performance extraction directly from the tip of any iron Easy extraction network

Metcal

Inline  Multi-Function Stencil Printer with Vision  KS-430A

Inline Multi-Function Stencil Printer with Vision KS-430A

New Equipment | Solder Paste Stencils

                 Inline  Multi-Function Stencil Printer with Vision  KS-430A Feature 1. Newest image recognition system 2. Equipment with automatic adjustable width function 3. PCB position system 4. Automatically clean stencil device 6. Simple

Beijing Chengliankaida Technology Co.,Ltd

Inline  Multi-Function Stencil Printer with Vision  KS-430A

Inline Multi-Function Stencil Printer with Vision KS-430A

New Equipment | Solder Paste Stencils

                 Inline  Multi-Function Stencil Printer with Vision  KS-430A Feature 1. Newest image recognition system 2. Equipment with automatic adjustable width function 3. PCB position system 4. Automatically clean stencil device 6. Simple

Beijing Chengliankaida Technology Co.,Ltd

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100 micron searches for Companies, Equipment, Machines, Suppliers & Information

PCB Handling Machine with CE

High Precision Fluid Dispensers
Solder Paste Dispensing

Best Reflow Oven
High Throughput Reflow Oven

World's Best Reflow Oven Customizable for Unique Applications