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New SMT Equipment: 104mm (Page 1 of 1)

Ultrasonic Engineering Al Wedge Wire Bonder

Ultrasonic Engineering Al Wedge Wire Bonder

New Equipment |

Spec. : Al wedge wire bonder, Fine wire 25 to 50 micron meter diameter, Rotation head, 60kHz Ultrasonic, Bonding area 104x104 mm Remarks : Manual

Tanaka Corporation

1

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2024 Eptac IPC Certification Training Schedule

Text Ad | "DONGGUAN KINGSUN AUTOMATION provides new & used SMT machines, peripheral equipment and accessories sales; Equipment maintenance & technical services, SMT full line solution and Clean Room/ESD engineering materials production, design, and installation services."

Selective Soldering Nozzles

High Throughput Reflow Oven

Gordon Brothers October 2-30, 2024 Auction

Best Reflow Oven

Solder Paste Dispensing

IPC Certification Training from the comfort of your home or office. See our 2024 Training schedule now.

"IPC training online, at your facility, or at one of our worldwide training centers including our brand-new training center in the Twin-Cities area of Minnesota. Blackfox Training."

Lewis and Clark, Inc. is the #1 provider of pre-owned Surface Mount and In-Circuit Test equipment.