The 3rd-generation M3 multi-function chip mounter implements high speed, stability and accuracy operation. The system meets the high-density, miniaturization, multi-encapsulation, large capacity, high precision characteristics requirement of LED fiel
Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly
Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
Features: 1. it is adjustable on height and x,y direction,aluminum alloy flat countertops,corrosion-resistant 2. easy to adjust,easy to operate,accurate and reliable. 3. metal frame,can achieve large area with thin workpiece surface precision prin
Layers: 1-20L Material Types: FR-4, High TG, Halogen Free Max.Panel Dimension: 530mm*622mm Outline Tolerance: ±0.10mm Board Thickness: 0.40mm-3.20mm Board thickness Tolerance(t=0.8mm):±10% Width: 0.10mm Spacing: 0.10mm External: 35um-140um Int
1. Aluminum backed 2. Single sided 3. Thermal conductivity: 2.0W/MK 4. White solder mask/ no text 5. 1 OZ copper finished 6. 1.0mm finished thickness 7. Immersion gold 8. Hexagonal shape, punch profile
impact bars impact bars and impact bed are made up of a cast aluminium T-slotted base covered in a solid block of 60 shore hard rubber with a 10mm polyethylene(PE) top.
Specification: 8L(1+6+1) Material: FR-4 Board thickness: 1.0mm Final copper: 18um Solder mask color: Green Silkscreen: White Surface Finish: Immersion Gold Profile: Routing and stamp holes E-test: 100% Fixture Quality report: Solder
Single-sided LED PCB/Star board Layer count: 1 Material: Polyronics TCB Aluminium base Board thiness: 1.0 mm Thermal conductivity: 2.0W/m-K Break down voltage: 3.0 KV Profile: Punch Surface treatment: HAL( lead free) Application: High
Materials: FR4 ,Aluminium,FPC layer: 1-12 Board thickness: 0.4-4.2mm Copper:0.5-3oz Finishing: Plating gold,immersion gold,immersion silver,Pb free HAL,OSP, Min.hole size: 0.10mm(Blind and burried hole available) Min. Line/Space: 0.10mm/0.10mm The
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