New Equipment | Test Equipment
The Rod-L M150AC Hipot Test Instrument is a rugged, self-contained tester designed for both laboratory and production use. The main purpose of the M150AC is provide a means of evaluating the dielectric withstand capabilities of the DUT. Specificati
New Equipment | Test Equipment
The Agilent 83752A sweeper brings outstanding synthesized performance to the component-test marketplace. It delivers the best performance for the price in general purpose benchtop, swept test or scalar applications. This sweeper provides superior acc
This PCB design utilizes surface mount technology Product Description This Double Sided Printed Circuit Board is a simple Surface Mount Technology PCB and is used within an Electronic Instrumentation Application Capabilities Applied/Processes Shea
Standard Printed Circuit Boards custom manufactured over 1,000 double-sided, high-temperature printed circuit boards (PCBs) for a client from the Telecom/IT Industry. These PCBs are capable of withstanding continuous operating temperatures of 250° Ce
This multilayer, high-frequency coupler, shown above, is used within a communications application for the telecom industry. Multilayer High Frequency Coupler Specifications: Product Description This Multi-Layer High-Frequency Coupler is used with
THE HOTFLOW SERIES: INDIVIDUALLY TAILORED TO YOUR NEEDS. Outstanding thermal performance, highest machine uptime and lowest operating costs have been the convincing advantages of Ersa reflow soldering systems for many years already. The HOTFLOW 3
New Equipment | Selective Soldering
The worldwide leading selective system for a perfect selective soldering process To satisfy all demands with regard to flexibility, Ersa has based the design of the third generation VERSAFLOW on a fully modular machine platform. A basic VERSAFLOW 3/
Boiler and Pressure Vessel Steel Plate Steel-exporter()zzjygt.com Skype: jy-steel-plate 1. Steel Standards: GB/T713, ASTM, GB713, JISG3103, JISG3115, JISG3118, JISG3119, JISG3124, GB6645, GB3531, DIN17155, ASME, EN10028-2, EN10028-2, NFA36-205, B
4 hours Thin Film Set Time (.001" @ 25°C) >12 hours Total % NV Solids 100% Hegman Gauge Volume Resi
New Equipment | Solder Materials
Solves: QFN Voiding | Head-in-Pillow | Graping Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by t
