New SMT Equipment: 12.1 (Page 1 of 5)

Tungsten Sheet,Plate,Boat,Cake,Alloy,Ball,Bar,Foil,Rod

Tungsten Sheet,Plate,Boat,Cake,Alloy,Ball,Bar,Foil,Rod

New Equipment |  

Tungsten Sheet,Plate,Boat,Cake,Alloy,Ball,Bar,Foil,Rod Alloy Sheet Foil Bar Wire W1 0.5-8.0 0.03-0.5 ��f2.0 f0.05-2.0 CW1 0.5-8.0 0.05-0.5 f2.0-5.0 f0.12-1.8 W2 0.5-8.0 0.05-0.5 ��f2.0 f0.12-1.8 WAl1 f2.8-11.0 f0.12-1.8

Shanghai Leading Metal Technology Co.,Ltd

Agilent DSO7012A DSO Oscilloscopes

Agilent DSO7012A DSO Oscilloscopes

New Equipment | Test Equipment

Agilent/HP DSO7012A Oscilloscope: 100 MHz, 2 analog channels Agilent s InfiniiVision DSO7012A, equipped with a 12.1” XGA display, comes in a quiet package that is just 6.5” deep, and weighs only 13 pounds. With the world s fastest uncompromised upd

Test Equipment Connection

Omron A22L-GY-24A-20M

Omron A22L-GY-24A-20M

New Equipment |  

A165L-AYM-12D-2 A165L-AYM-24-1 A165L-AYM-24-2 A165L-AYM-24D-1 A165L-AYM-24D-2 A165L-AYM-5-1 A165L-AYM-5-2 A165L-AYM-5D-1 A165L-AYM-5D-2 A165L-JA A165L-JAA-12-1 A165L-JAA-12-2 A165L-JAA-12D-1 A165L-JAA-12D-2 A165L-JAA-24-1 A165L-JAA-24-2 A165L-JAA-24D

Zhengzhou Weilin Electronic Technology Co.,ltd

Printed Circuit Board

Printed Circuit Board

New Equipment | Printing

Layer: 8 layers Material: FR-4 Board Thickness: 0.6mm Surface Finish: Immersion Gold 1~4u Copper Thickness: 1/3 oz Impedance, 4/4mils width/spacing Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ M

Multycircuit Technology Limited

Power PCB

Power PCB

New Equipment | Design Services

Layer:4 Material:FR-4 4/4/4/4oz Thickness:2.0 Minimum hole:0.35mm Minimum Tracc/Spacing:12mil/15mil Application:power supply Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ Min line width/space:  

Multycircuit Technology Limited

Rigid PCB

Rigid PCB

New Equipment | Materials

Layer: 2 Material: FR-4 Board Thickness: 1.6mm Surface Finish: HAL Copper Thickness: 2/2 oz Green Solder Mask Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ Min line width/space:   3mil/3mil Min

Multycircuit Technology Limited

Multilayer PCB

Multilayer PCB

New Equipment | Inspection

Layer: 6 layers Material: FR-4 Board Thickness: 1.0mm Surface Finish:ENIG Copper Thickness: 1 oz all layers Blind via L1~L2 and L1~L3 Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ Min line width

Multycircuit Technology Limited

Yamaha Mounter machine

Yamaha Mounter machine

New Equipment | Pick & Place

applicable PCB: L510*W460mm-L50*W50mm Mounting capability: 46,000CPH Applicable components: 03015-W55*L100mm, H:15mm or less Mounting accuracy:±0.035mm(±0.025mm) CPK≥1.0 Number of components types: setting plate: Max 96 types(8mm) Tray: 15 types

Shenzhen Maxsharer Technology Co., Ltd

E 1103706CA0 JUKI FEEDER Wheel

E 1103706CA0 JUKI FEEDER Wheel

New Equipment | Components

JUKI FEEDER Wheel E1103706CA0 E1402706AA0 GUIDE PLATE ASM. 1 E1201706AA0 UPPER COVER 05 ASM. 1 E1115706AB0 KNOCK LEVER LINK ASM. 1 E1400706C00 GUIDE COVER 1 E1214706000 FRONT BRACKET 1 E1411706A00 THROAT GUIDE 05 1 E1112706C00 STOPPER HOOK 2MM 1 E14

ZK Electronic Technology Co.,Limited

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12.1 searches for Companies, Equipment, Machines, Suppliers & Information

pressure curing ovens

World's Best Reflow Oven Customizable for Unique Applications
Best SMT Reflow Oven

High Throughput Reflow Oven
convection smt reflow ovens

Training online, at your facility, or at one of our worldwide training centers"


500+ original new CF081CR CN081CR FEEDER in stock