We have original new and original used, copy new JUKI machine feeder ,If you have interest,you can contact us thanks zoey@jinchensmt.com AQ02HP Feeder 0402 8mm CF03HP Feeder 0603 8mm CF05HP Feeder 1005 8mm CF08HE Feeder 8mm CF081P Feeder 8mm C
New Equipment | Industrial Automation
E1B800 R400 PR121/P-LI FHR NST E1B800 R400 PR121/P-LSI FHR NST E1B800 R400 PR121/P-LSIG FHR NST E1B800 R400 PR122/P-LI FHR NST E1B800 R400 PR122/P-LSI FHR NST E1B800 R400 PR122/P-LSIG FHR NST E1B800 R400 PR123/P-LSI FHR NST E1B800 R400 PR123/P-LSIG F
Wisdom Shining Electronic Technology (China) Limited supply Panasonic MV MSR MPAG3 HT121 HDP HDF spare part: AIR CYLINDER MV N403XCHA-164 AIR CYLINDER MSR N401MQQL-H37 AIR CYLINDER MSR N401MQQL-H38 AIR CYLINDER MSR N401MQQL-H39 MA NOZZLE MV 1022
New Equipment | Test Equipment
Agilent/HP DSO7012A Oscilloscope: 100 MHz, 2 analog channels Agilent s InfiniiVision DSO7012A, equipped with a 12.1” XGA display, comes in a quiet package that is just 6.5” deep, and weighs only 13 pounds. With the world s fastest uncompromised upd
New Equipment | Solder Materials
KappAloy9™ 91% Tin / 9% Zinc solder is the eutectic standard solder for Aluminum to Aluminum and/or Copper. It is used extensively in oven soldering and other automated soldering systems. Learn more and order: http://www.solderdirect.com/all-produc
New Equipment | Solder Materials
KappAloy9™ - 91%Sn - 9%Zn - 390°F (199°C) eutectic alloy is the best solder for soldering Aluminum wire to Copper busses or soldering Copper wire to Aluminum busses or contacts. Its low eutectic melting point minimizes heating of critical electrical/
New Equipment | Assembly Services
High density PCB, High Density Interconnect PCBs (HDI PCBs) ︱HDI board, HDI PCB︱PCB, printed circuit board, printed wiring board, rigid PCB︱Multilayer printed circuit board︱Heavy copper PCB︱Flexible PCB, FPCB︱rigid-flex PCB, Flex-rigid PCB︱Bergquist
Layer: 8 layers Material: FR-4 Board Thickness: 0.6mm Surface Finish: Immersion Gold 1~4u Copper Thickness: 1/3 oz Impedance, 4/4mils width/spacing Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ M
New Equipment | Design Services
Layer：4 Material：FR-4 4/4/4/4oz Thickness：2.0 Minimum hole：0.35mm Minimum Tracc/Spacing：12mil/15mil Application：power supply Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width/space:
Layer: 2 Material: FR-4 Board Thickness: 1.6mm Surface Finish: HAL Copper Thickness: 2/2 oz Green Solder Mask Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width/space: 3mil/3mil Min
