New Equipment | Test Equipment
Koh Young KY8080 3D SPI Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg Product description: Koh Young KY8080 3D SPI, Min component: 01005, PCB size:350x330mm, weight:600kg, Dimension:1000x1335x1627mm Koh Young KY808
New Equipment | Rework & Repair Equipment
The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o
New Equipment | Assembly Services
• Place of Origin: Guangdong, China (Mainland) • Brand Name: ShanXu • Model Number: PCB RoHS Compliant • Number of Layers: 1-30 layer • Base Material: FR4, High Tg FR4, Halogen Free, SYL, Rogers, Aluminium • Copper Thickness: 1/3oz ~ 6oz • Boar
Complete Fuji Line capable of placing 0402's-QFP's, BGA's. Capable of 15 mil pitch.
New Equipment | Solder Paste Stencils
Dry Film Solder Application SolderMask, Inc. continues to apply Dry Film Solder Mask (DFSM) on Printed Circuit Boards (PCB) since opening for business in 1985. SolderMask, Inc. works with all DFSM available in the United States. Some of the DFSM ma
New Equipment | Solder Materials
AMTECH’s BGA solder spheres are manufactured from virgin materials to meet or exceed the requirements of building or repairing BGA packages. AMTECH BGA solder spheres also exceed both the IPC and MIL standards for purity levels and size tolerances. N
New Equipment | Design Services
Layer：4 Material：FR-4 4/4/4/4oz Thickness：2.0 Minimum hole：0.35mm Minimum Tracc/Spacing：12mil/15mil Application：power supply Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width/space:
New Equipment | Fabrication Services
Quantity: 5pcs Lead Time: 7 working days Number of layers: 2 layers Max board dimensions: 6300x3900mils/160x100mm Material: R-4, Tg130 Finished Thickness: 63mil/1.6mm Min Trace/space: 6mil/0.15 Min.Holes size: 12mil/0.3mm Copp
New Equipment | Fabrication Services
Quantity: 5pcs Lead Time: 7 working days Number of layers: 4 layers Max board dimensions: 6300x3900mils/160x100mm Material: R-4, Tg130 Finished Thickness: 63mil/1.6mm Min Trace/space: 6mil/0.15mm Min.Holes size: 12mil/0.3mm Co
In-House PCB Through-Hole Plating without Chemicals The LPKF ProConduct® introduces revolutionary technology to produce plated through-holes, which does not require a plating tank or potentially hazardous processing chemicals. This compact system is
