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Henkel CSP and BGA Underfills

Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance

Henkel Electronic Materials

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2024 Eptac IPC Certification Training Schedule

Training online, at your facility, or at one of our worldwide training centers"

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Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...

"IPC training online, at your facility, or at one of our worldwide training centers including our brand-new training center in the Twin-Cities area of Minnesota. Blackfox Training."

Component Placement 101 Training Course

PCB Reverse Engineering, Redesign, & Repair Services & Equipment