New SMT Equipment: 2015 achieve apexcel (Page 1 of 7)

Kiheung PCB Laser Marking Machine

Kiheung PCB Laser Marking Machine

New Equipment | Assembly Services

In-Line machine designed for printing letters, barcodes (1D & 2D), serial numbers, and lot more. Conveyor unit is designed to be highly accurate with high speed achieved by X-Y servo motor. Semi-permanent and it has no replacement parts.

Advanced Mechatronics Solutions, Inc.

TNP Series Compact N2 Reflow Soldering Ovens

TNP Series Compact N2 Reflow Soldering Ovens

New Equipment | Reflow

Outstanding heating capacity by the existing hot air circulation system that has been proven excellent by its actual achievements. Enhanced maintenanceability by loading the flux collection unit. PC-controlled high operationabilty Various ser

Tamura H.A. Machinery, Inc.

Dewaxing Autoclave

Dewaxing Autoclave

New Equipment | Other

Automatic Dewaxing Autoclave is used for removal of wax from ceramic shell in the shortest cycle time. It is simple to operate and safe to use. The Dewaxing Autoclave is a jacketed autoclave where the jacket has been extended to form an integral boi

Qinhuangdao Fuge Science & Technology Co., Ltd

Dry cabinet for well-storage of PCB, IC, SMD comply with JEDEC-033C(XC-200G Auto dry cabinet, 5%RH).

Dry cabinet for well-storage of PCB, IC, SMD comply with JEDEC-033C(XC-200G Auto dry cabinet, 5%RH).

New Equipment | Reflow

Specification Humidity Range:<5%RH External Dimension:W600*D672*H632mm Internal Dimension:W598*D642*H525mm Capacity:202L Cabinet Color: black Structure:1mm thick carbon steel with antistatic paint. ESD Paint: 103~109 ω (surface resistance)

Ace Dragon Corp.

Mydata MY600 High-Speed SMT Jet Printer

Mydata MY600 High-Speed SMT Jet Printer

New Equipment | Printing

MY600 - Millions of dots ahead of its time. The next-generation MY600 Jet Printer now enables SMT producers to achieve optimal solder joints on complex boards at speeds of more than one million dots per hour, a 50% increase in throughput compared to

Mycronic AB

HEPCO 9400-1 BGA Solder Sphere Placement System

HEPCO 9400-1 BGA Solder Sphere Placement System

New Equipment | Pick & Place

The Model 9000 operates using a self-contained vacuum system to secure the BGA component while transferring the desired pattern of solder sphere's in a full array. Alignment is achieved through precision pins and specific tooling for ease of use, re

HEPCO, Inc.

EXCEN FLEX All-In-One SMT Mounter

EXCEN FLEX All-In-One SMT Mounter

New Equipment | Pick & Place

All-in-one mounter with dual gantry modular machine using a 12 nozzle flying camera, achieves the world’s highest placement speed of 82,000 CPH. EXCEN FLEX, a dual gantry modular machine using a 12 nozzle flying camera, achieves the world’s highest

Hanwha Techwin CO., LTD.

Underfill FF35

Underfill FF35

New Equipment | Materials

Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Underf

AIM Solder

Juki KE-3020 High Speed Flexible Mounter

Juki KE-3020 High Speed Flexible Mounter

New Equipment | Pick & Place

The KE3020 is Juki's latest leading-edge technology for improved flexibility and production quality. It supports both electronic and mechanical tape feeders and can handle boards up to 22" x 24". With its multi-nozzle (six nozzles) laser head, the KE

Juki Automation Systems

PLS186 Solder Paste Mixer

PLS186 Solder Paste Mixer

New Equipment | Solder Paste Mixers

PLS186 applies revolution and rotation mixing method with motor, effectively mixes the solid state and liquid state equality, to achieve perfect printing and reflow effect, save the manpower. Of course, it not need to open the pot in order to reduce

Plastlist Group


2015 achieve apexcel searches for Companies, Equipment, Machines, Suppliers & Information

Circuit Board, PCB Assembly & electronics manufacturing service provider

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