New Equipment | Cleaning Equipment
Technical Devices Company is proud to celebrate 25 years of the Nu/Clean Galaxy. The Nu/Clean Galaxy has been an asset to hundreds of companies throughout the last 25 years, including General Atomics, Xerox-Flextronics, Skyworks, and Betatron just t
New Equipment | Cleaning Agents
MICRONOX MX2302 is an engineered semi-aqueous solvent blend designed to remove difficult flux and paste residues from wafer bumps found in die-attach, flip chip, copper pillar, and emerging semiconductor assemblies. MX2302 is used as received in all
New Equipment | Cleaning Agents
IONOX I3302 is a semi-aqueous cleaning agent designed for cleaning the most challenging SMT Pb-free solder paste and tacky flux paste residues. This solution is also safe and effective for use on the newest Sn/Bi solder paste formulas. I3302 is high
New Equipment | Cleaning Agents
Broad Spectrum Electronics Cleaning Solvent IONOX® I3302 is a semi-aqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux, as well as other common electronic assembly residues.
New Equipment | Cleaning Agents
AQUANOX A4625B was developed specifically to remove all types of solder pastes and flux residues from printed circuit board assemblies, including the latest lead-free solder paste formulas. Originally designed to address the challenges of batch clean
New Equipment | Cleaning Agents
KYZEN E5611 is a concentrated aqueous cleaning chemistry designed to remove non-reflowed solder paste and uncured chip bonder adhesives from stencils and hardware following the printing process. E5611 works on a wide range of solder paste technologie
New Equipment | Cleaning Agents
AQUANOX A4382 is a near-neutral range pH chemistry designed with superior cleaning efficacy with great material compatibility on surface mount assemblies. A4382 most effectively cleans organic acid flux residues at lower concentrations. AQUANOX A4382
New Equipment | Cleaning Agents
MICRONOX MX2322 is a semiconductor grade semi-aqueous solvent that is designed to clean all types of paste fluxes common in wafer bumping, wafer-level packaging, die-attach, flipchip and SiP containing copper pillar. MICRONOX MX2322 demonstrates its
New Equipment | Cleaning Agents
239°F / 115°C Water Soluble: Complete VOC, @ 100% 1034 g/L MICRONOX products are semiconductor grade cleaning chemistries for defluxing and particulate removal for the Advanced Packaging, Microelectronics and Semiconductor industries. Other KYZ
New Equipment | Cleaning Agents
210°F / 99°C Boiling Point: 266°F / 130°C Water Soluble: Complete VOC, @ 10% 90.1 g/L MICRONOX products are semiconductor grade cleaning chemistries for defluxing and particulate removal for the Advanced Packaging, Microelectronics and Semicond
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