New SMT Equipment: 20um (Page 1 of 1)

Koh Young KY8080 3D SPI

Koh Young KY8080 3D SPI

New Equipment | Test Equipment

Koh Young KY8080 3D SPI Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg Product description: Koh Young KY8080 3D SPI, Min component: 01005, PCB size:350x330mm, weight:600kg, Dimension:1000x1335x1627mm Koh Young KY808

Qersa Technology Co.,ltd

KOH YOUNG Zenith UHS 3D AOI

KOH YOUNG Zenith UHS 3D AOI

New Equipment | Test Equipment

KOH YOUNG Zenith UHS 3D AOI Camera: 12M 15um Max PCB: 490 x 510 mm Weight: 600kg Dimension: 820x1265x1627 mm KOH YOUNG Zenith UHS 3D AOI KOH YOUNG Zenith UHS 3D AOI A model with 8 projections and an 8MPx camera. This model is very resistant t

Qersa Technology Co.,ltd

TROI

TROI

New Equipment |  

3D Solder Paste Inspection System (SPI) Color Image Processing 12um, 18um & 20um Resolution Accomodates M,L & XL PCB Sizes

Pemtron

BGA Spheres

BGA Spheres

New Equipment | Solder Materials

BGA Solder Sphere is made from pure metals, to produce exact alloy compositions. We developed and produced under a strict research and quality control policy. Our Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip applications are made by the UM

Shenmao Technology Inc.

Rogers PCB

Rogers PCB

New Equipment | Components

Bicheng provides R&D, high-tech, IT research companies and organizations large or small with  high frequency RF/microwave PCB's. Technical parameters: *NPTH and PTH( 20 um)             *Thermal stress: 288C/10sec             *Permitivity: ER2.1-1

Bicheng Enterprise Company

PCB Assembly Manufacturing huanyupcb.com

PCB Assembly Manufacturing huanyupcb.com

New Equipment | Assembly Services

PCB Assembly HuanYu Future  provides consigned assembly services for electronics manufacturers  in small volume NPI format. We have procured seven lines of extremely high  end SMT chipshooters, and with our own advanced management system, we build 

PCB Manufacturer HuanYu Technologies Co., Ltd.

850G Die Placement AOI

850G Die Placement AOI

New Equipment | Inspection

Microelectronics and Semiconductor Inspection. MVP's 850G provides the highest accuracy flip-chip, die assembly inspection. Ensuring the correct placement of the die on the substrate, while providing edge, FM and surface inspection. The 850G modu

Machine Vision Products, Inc

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20um searches for Companies, Equipment, Machines, Suppliers & Information

Win Source Online Electronic parts

Software for SMT placement & AOI - Free Download.
PCB Handling Machine with CE

Smt Feeder repair service centers in Europe, North, South America
Voidless Reflow Soldering

Stencil Printing 101 Training Course
High Throughput Reflow Oven

High Precision Fluid Dispensers
design with ease with Win Source obselete parts and supplies

Private label coffee for your company - your logo & message on each bag!