vintage : 2000 year ,with 2D inspection function wet/dry wiper cleaning
Screen Printer NPS510E Printer with emphasized simplicity and economic efficiency •±12.5㎛ high-accuracy alignment •Rigid structure of Stage and Vision unit •Conveyor formation according to customer requirements - Possible for 3 step buffer conv
The Viking delivers access to added value features and advanced options never before available in semi-auto formats including fully automatic vision alignment, the DEK adjustable stencil mount, ProFlow and 2D inspection. Stencils up to 29" x 29" can
The XACT 4 automatic screen and stencil printer is specially designed to perform any kind of production demands within the electronic industry, and therefore paying special attention to its universal usage. The XACT 4 features the exceptional EKRA ea
MODEL NAME :HPX-1300S - LED Screen Printer with 2D Inspection Benefit High speed printing realization (2.0Cpk @ ±25㎛) Fine Pitch(0.2mm) , CSP , 0402 Control of printing speed and pressure over 5 sections Variou
HawkEye is an automatic print verification technology that operates at the line beat rate. The system can be configured to assess 100% of printed boards and gives a rapid go/no-go indication for each, meaning that faulty boards can now be automatical
Automated 2D inspection Unsurpassed image quality Highest defect detection, low false calls Fast throughput Quick set-up Cost effective Nordson YESTECH’s versatile X2 Automated 2D X-Ray Inspection System (AXI) offers complete i
Advanced LED Solder Paste Printer with 2D SPI On-Board LED screen printer with Advanced Vision System for all PCB types Standard Features Include: 2D Solder Paste 3 Stage Automatic Under Stencil Cleaning Full Process Control
High Performance 3-D Solder Paste Inspection with Quality Uplink Extremely fast and highly accurate in-line inspection Viscom's S3088 SPI inspection system is an extremely fast and highly precise inline system for 3-D solder paste inspection. The 3
Virtual Panel Tooling provides just that: dozens of substrates are independently aligned, simultaneously, creating a virtual panel ready for imaging in a single cycle. This concept delivers high throughput comparable to processing panelised substrate
