New SMT Equipment: 3

Smt I-pulse K01 nozzle used in pick and place machine

Smt I-pulse K01 nozzle used in pick and place machine

New Equipment | Pick & Place

Smt I-pulse K01 nozzle used in pick and place machine Smt I-pulse K01 nozzle used in pick and place machine I-pulse series nozzles: 1.M1/M4 type:M001/M002/M003/M004/M005/M006/M012/M013/M017/M018/M019/M020/M021/M022/M031/M032/M033 2.M2 type:N001/N00

ZK Electronic Technology Co., Limited

JUKI Nozzle for 700&2000 series

JUKI Nozzle for 700&2000 series

New Equipment | Pick & Place

JUKI Nozzle for 700&2000 series KD775&780E3401-802-000JUKIKD775 DISP NZ S2D/1S 0.6/0.3P=0.7E3406-802-00JUKI KD775 DISP NZ M1D/2S 0.7/0.4P=1.0E3411-802-000JUKI KD775 DISP NZ L1D/1S 0.9/0.6P=1.5E3416-802-000JUKI KD775 DISP NZ LL 2D/2S 0.9/0.6P=1.5E342

ZK Electronic Technology Co., Limited

In-line X-Ray MX-2000 Inspection System

In-line X-Ray MX-2000 Inspection System

New Equipment | Inspection

In-line X-Ray MX-2000 Inspection System Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector  Module, Cables, Aerospace Components, Photovoltaic Industry, etc.

QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd

Koh Young KY8080 3D SPI

Koh Young KY8080 3D SPI

New Equipment | Test Equipment

Koh Young KY8080 3D SPI Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg Product description: Koh Young KY8080 3D SPI, Min component: 01005, PCB size:350x330mm, weight:600kg, Dimension:1000x1335x1627mm Koh Young KY808

Qersa Technology Co.,ltd

StencilMate™ Leadless Device Rework Stencils

StencilMate™ Leadless Device Rework Stencils

New Equipment | Solder Paste Stencils

Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o

BEST Inc.

HeatShields™ Ceramic Thermal Shielding Material for PCB Rework

HeatShields™ Ceramic Thermal Shielding Material for PCB Rework

New Equipment | Rework & Repair Equipment

Protecting Heat Sensitive Components. Are you in need of a flexible method for shielding nearby components during the PCB rework process? Do you find yourself looking for an effective heat shielding product which can be easily modified to protect a

BEST Inc.

StencilQuik™ BGA Rework Stencils

StencilQuik™ BGA Rework Stencils

New Equipment | Solder Paste Stencils

Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process?  Are you squeezed for space on the PCB in an

BEST Inc.

KappZapp3.5™ - Tin-Silver Solder for Stainless Steel to Stainless Steel and Copper

KappZapp3.5™ - Tin-Silver Solder for Stainless Steel to Stainless Steel and Copper

New Equipment | Solder Materials

KappZapp3.5™ is the most popular of the low temperature Silver bearing solders. It melts completely at just 430°F (221°C). This minimizes the heat applied to your sensitive electronic parts and minimizes distortion of thin wire or tabs. Learn more

Solder Direct

KappZapp3.5A Acid-cored Silver Solder

KappZapp3.5A Acid-cored Silver Solder

New Equipment | Solder Materials

KappZapp3.5A Acid-cored Solder is a convenient solder for most Copper, Brass and Stainless Steel plumbing and sheet applications. The center of the solder contains an acidic flux. When the solder is heated, the flux is released and removes the oxide

Solder Direct

KappZapp3.5R Rosin-cored Solder

KappZapp3.5R Rosin-cored Solder

New Equipment | Solder Materials

KappZapp3.5R Rosin-cored Solder is a convenient solder for most Copper, Brass and Stainless Steel plumbing and sheet applications. The center of the solder contains a Rosin flux. When the solder is heated, the flux is released and removes the oxide c

Solder Direct

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