New SMT Equipment: 38 inch conveyor height (Page 1 of 4)

Koh Young KY8080 3D SPI

Koh Young KY8080 3D SPI

New Equipment | Test Equipment

Koh Young KY8080 3D SPI Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg Product description: Koh Young KY8080 3D SPI, Min component: 01005, PCB size:350x330mm, weight:600kg, Dimension:1000x1335x1627mm Koh Young KY808

Qersa Technology Co.,ltd

1.5m SMT Link Conveyor/ Linkage Conveyor /SMD Link Conveyor Smema Port

1.5m SMT Link Conveyor/ Linkage Conveyor /SMD Link Conveyor Smema Port

New Equipment | Board Handling - Conveyors

Second-ranking double rack/gear adjustable wide organization, ensure transportation guide mutual parallel; > Machine adopts professional wear-resisting anti-static belts, special aluminum guide rail, ensure smooth shuttle smooth, transportation; >

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Wave Solder Outfeed Conveyor

Wave Solder Outfeed Conveyor

New Equipment | Board Handling - Conveyors

The Wave Solder Outfeed Conveyor is used to unload PCBs from the inclined conveyors of wave solder and to then lower the soldered boards to a standard conveyor height. The angle of the shorter inlet section can be adjusted to match the angle of the w

HuiKe Tech

EWS-310 Wave Soldering Machine

EWS-310 Wave Soldering Machine

New Equipment | Wave Soldering

Economic, low to medium, automatic, 11.8" (310mm) wave soldering system with "L" finger conveyor for pallet or pallet-less board transport. The EWS-310 Wave Soldering Machine provides quick loading of PCBs from the onload conveyer extensions onto t

DDM Novastar Inc

Telescopic Gate Conveyor

Telescopic Gate Conveyor

New Equipment | Board Handling - Conveyors

Apply  The Telescopic Gate Conveyor is used for creating a passage in the PCB assembly line to give the operator access to the rear of the production equipment. Features 1. PLC Control system. 2. FUJI button, easily operation. 3. Fully ope

HuiKe Tech

Tamura Reflow Oven - Model : BNS40-38LN

Tamura Reflow Oven - Model : BNS40-38LN

New Equipment |  

Lead Free 4 Top 4 Bottom plus 1 cooling zone Vintage: 2003 Specs: Substrate size(min/max): L100xW25mm/ L250xW75mm Substrate Height : 10mm max (upper) Transfer method : wire belt conveyor method Transfer height : 900 A+/- 20

Unigate Electronic Enterprises

SCS Curing Systems

SCS Curing Systems

New Equipment | Curing Equipment

When materials require UV curing, manufacturers turn to the SCS Precision UVC as a reliable, robust staple in their production line. When mated with the SCS Precisioncoat, components move from coating to curing automatically, with the UV cure process

Specialty Coating Systems

Agilent Medalist SP50 Series 3 - SPI

Agilent Medalist SP50 Series 3 - SPI

New Equipment | Inspection

Automated 3D paste inspection for print process characterization, control and early defect prevention Best-in-class shadow free 3D paste measurement from the world’s leader in test and measurement. The Medalist SP50 Series 3 Dual Laser system is th

Agilent Technologies, Inc.

14FS Single and 14FD Dual Wave Solder Machines

14FS Single and 14FD Dual Wave Solder Machines

New Equipment | Wave Soldering

Cost effective, medium to high volume, automatic titanium finger 14" single and dual wave soldering systems. Medium to High Volume Production Wave solder machine with complete automation of self-contained fluxing, preheating, laminar (smooth) and

DDM Novastar Inc

18FS Single and 18FD Dual Wave Solder Machines

18FS Single and 18FD Dual Wave Solder Machines

New Equipment | Wave Soldering

Automatic wave solder system with self-contained fluxing, preheating and laminar (smooth) solder wave modules. Wave Solder Machines for Lead-Free Soldering Medium to High Volume Production Automatic wave solder system Best value through

DDM Novastar Inc

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