New Equipment | Assembly Services
1,012 (normal) Electric strength: >1.3kV/mm Thermal stress: 288°C, 20 seconds Test voltage: 50 to 300V
New Equipment | Assembly Services
1,012 (normal) Electric strength: >1.3kV/mm Thermal stress: 288°C, 20 seconds Testing voltage: 50 to 300V Packing: vacuum packing for PCB, and good condition outer boxes
New Equipment | Fabrication Services
ENIG PCBs with red soldermask Layers: 2 Base material: FR4 Copper thickness: 1oz Board thickness: 1.6mm Min. hole size: 0.45mm Min. line width: 3 mils Min. line spacing: 3 mils Surface finishing: HASL
New Equipment | Fabrication Services
Layers: 2 Base material: FR4 Copper thickness: 1oz Board thickness: 1.6mm Min. hole size: 0.45mm
New Equipment | Fabrication Services
Layers: 2 Base material: FR4 Copper thickness: 1oz Board thickness: 1.6mm Min. hole size: 0.45mm
New Equipment | Solder Paste Stencils
Dry Film Solder Application SolderMask, Inc. continues to apply Dry Film Solder Mask (DFSM) on Printed Circuit Boards (PCB) since opening for business in 1985. SolderMask, Inc. works with all DFSM available in the United States. Some of the DFSM ma
Capabilities include: 1 to 20 layers, adhesive based or adhesiveless, 3 mil traces and spaces, 6 mil drilled holes, available in 3 days to 20 days
Capabilities include: Up to 30 layers, 3 mil traces and spaces, 6 mil drilled holes, available in 24 hours to 2 weeks.
Capabilities include: 2 to 20 layers, 3 mil traces and spaces, 6 mil bond pitch, 6 mil drilled holes, internal cavity and consistent wire bondable gold.
Fab technology includes; 3 mil trace, 5 mil vias, micro SMT & BGA, controlled impedance, high speed dielectric laminates, blind & buried vias.
