The 3rd-generation M3 multi-function chip mounter implements high speed, stability and accuracy operation. The system meets the high-density, miniaturization, multi-encapsulation, large capacity, high precision characteristics requirement of LED fiel
0.3μm No Damage: SO.I Volt CV-shift Uniformity: 100mm : ± 3% (5% 3 sigma) • 150mm : ± 5% (8% 3 sigma)• max.- min. /2 x average
PAM+ is a graphic software tool designed to give the users the ability to verify machine placement accuracy...without the need for AOI or external camera systems. Automatically calculates and displays current Cp, Cpk and 3 Sigma values according to t
Automated Prototype2Production Bonder. The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure allows very demanding applications in a controlled environment. Fully protecte
Performance and precision in a tiny footprint. The SIPLACE TX placement modules are the new standard in high-volume production. No other placement solution features this level of precision (22 µm at 3 sigma) and speed (up to 78,000 cph) in such a ti
placement machines range from the full-featured, entry level priced, 96 feeder MY9 to the high mix, high volume, 240 feeder MY19. Mydata is famous for flexibility, high mix, ease-of-use, and fast programming yet can place up to 21,000 CPH with the 8
With the MY200 pick-and-place series, we’ve combined the advantages of our high-mix thinking into a flexible, fully integrated solution that works at virtually any volume. The MY200-series contains new and advanced technologies, that give our custo
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