Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
SHF-1.5K-A 4,000 SHF-1.5K-B/SPF-2.2K-B 4,600SHF-2.2K-A 4,500 SHF-2.2K-B/SPF-4.0K-B 5,300 SHF-4.0K-A 5,400 SHF-4.0K-B/SPF-5.5K-B 6,300 SHF-5.5K-A 6,200 SHF-5.5K-B/SPF-7.5K-B 6,800 SHF-7.5K-A 7,200 SHF-7.5K-B/SPF-11K-B 8,000 SHF-11K-A 1
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