Nutzentrennmaschine/Nutzentrenner ASCEN-620 NSL zum Trennen von Aluminium Leiterplatten/FR4 www.ascen.us Seit mehr als 10 Jahren werden unsere Nutzentrennmaschinen kontinuierlich weiterentwickelt und verbessert, um spannung
The PCB Depanelers more detail and video please check the link: www.pcb-separator.com Any inquiry please sent the email to : info@pcbasc.com This machine can use for all kinds of PCB board. 1. Cutting with the double straight knives,
ASCEN-620 Depaneling machine for separating aluminium panel-FR4/CEM-1 The more detail and video please check the link: www.pcb-separator.com For more than 10 years our PCB depaneling machines are developed and improved continuously, in orde
ASCEN-620 Depaneling machine for separating aluminium panel-FR4/CEM-1 Our product can cut the board with the led chip no damage and no bend. After extensive tests of the separation process a lot of automobile suppliers use exclusively the depan
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
New Equipment | Rework & Repair Equipment
The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o
1~6 layers, based film PI and PET, RA/ED Copper, Coverlay 0.50~2.0mil, Min. line/space +/-2mil, Outline by routing and laser cut. Sample lead time 5~7 days, mass production 10~14 days.
1~6 layers, based film PI and PET, RA/ED Copper, Coverlay 0.50~2.0mil, Min. line/space +/-2mil, Outline by routing and laser cut. Sample lead time 5~7 days, mass production 10~14 days.
Aluminum and Copper type metal PCB (1~2 layer). Metal thickness 0.50~0.40mm, Dielectric 75~150um, Copper 0.50~10oz. 1.0W~3.0W/Mk. Outline by routing and punching. Sample lead time 5~7 days, Mass production 10~14 days.
Aluminum and Copper type metal PCB (1~2 layer). Metal thickness 0.50~0.40mm, Dielectric 75~150um, Copper 0.50~10oz. 1.0W~3.0W/Mk. Outline by routing and punching. Sample lead time 5~7 days, Mass production 10~14 days.
