New SMT Equipment: acceptable voids (Page 1 of 1)

IPC 6012C Qualification and Performance Specification for Rigid Printed Boards

IPC 6012C Qualification and Performance Specification for Rigid Printed Boards

New Equipment | Education/Training

This specification covers qualification and performance of rigid PCBs including with or without plated-through holes, single-sided, double-sided, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surfac

BEST Inc.

IPC-A-600H Standard

IPC-A-600H Standard

New Equipment | Education/Training

IPC A-600H Acceptability of Electronic Assemblies. The IPC-A-600, "Acceptability of Printed Boards " is the most widely used published specification on printed wiring boards. This specification has set the standard for rigid printed boards in terms o

BEST Inc.

IPC 6012D Qualification and Performance Specification for Rigid Printed Boards

IPC 6012D Qualification and Performance Specification for Rigid Printed Boards

New Equipment | Other

IPC 6012 Qualification and Performance Specification for Rigid Printed Boards This specification covers qualification and performance of rigid PCBs including with or without plated-through holes, single-sided, double-sided, multilayer with or withou

soldertools.net

IPC-A-600H Standard

IPC-A-600H Standard

New Equipment | Education/Training

IPC A-600H Acceptability of Electronic Assemblies. The IPC-A-600, "Acceptability of Printed Boards " is the most widely used published specification on printed wiring boards. This specification has set the standard for rigid printed boards in terms o

soldertools.net

XM8000 Wafer X-ray Metrology Platform

XM8000 Wafer X-ray Metrology Platform

New Equipment | Inspection

Fast Automatic X-ray Measurement of TSVs, MEMS and Wafer Bumps for Voiding, Fill Level, Overlay & Other Critical Dimensions. Measuring the Invisible™ This new platform takes the market-leading capabilities from Nordson DAGE’s existing X-ray systems

Nordson DAGE

Bob Willis Electronics Assembly Video Library

Bob Willis Electronics Assembly Video Library

New Equipment | Education/Training

Bob Willis has an extensive range of training videos available online. The complete video collection is available to view online for a fixed fee, based on a six month period. After purchase you are provided with links to each of the online videos for

ASKbobwillis.com

Image Processors For Real-Time X-ray Inspection Systems

Image Processors For Real-Time X-ray Inspection Systems

New Equipment | Inspection

GTI-5000 BGA "Surface Mount" PCB Analysis The GTI-5000 Computer Image Processor is designed for the x-ray analysis of surface mount, BGA and PCB components. The software can provide analysis of BGA defects including bridging, voids and missing ball

Glenbrook Technologies

Sonoscan DF2400 Automated CSAM

Sonoscan DF2400 Automated CSAM

New Equipment | Inspection

FACTS²™ DF2400™ C‑SAM® Automated In-line Inspection Tool for Defect-Free Production Without Sacrificing Throughput The FACTS²™ delivers state-of-the-art, automated in-line inspection for quality and process control. Delivering high throughput wit

Sonoscan, Inc.

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acceptable voids searches for Companies, Equipment, Machines, Suppliers & Information

Best SMT Reflow Oven

World's Best Reflow Oven Customizable for Unique Applications
SMT Machines

High Throughput Reflow Oven
2024 Eptac IPC Certification Training Schedule

High Precision Fluid Dispensers
2024 Eptac IPC Certification Training Schedule

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.