New Equipment | Curing Equipment
Flexible - Multi-wave-length Arc-lamps cures most coatings and glues without the need of changing lamps. Compact - Overall length of only 1600 mm, including -Inspection module -Dual Arc lamp ramps and cooling zone. Energy efficient - Energy consump
Specifically engineered for water resistance on printed circuit board protection and LED component protection in membrane switches. Surface Resistivity: 3.8 x 1014 ω/■ Insulation resistance of cured films of UV-3010 at 100°C and 95% relative h
Product Description Thermally Conductive Adhesive Transfer Tapes 5715 is designed to provide a heat-transfer path between heat-generating components and heat sinks or other cooling devices, it can be used to seal gaps among PCBs, heat dissipating mo
Turnkey Manufacturing, PCB Assembly and New Product Introduction experts. Lean Manufacturing experts. QS9000 certified for Automotive manufacturing. Apple Computer certified for PC components manufacturing. ISO-9002 certified. Industrial and com
Turnkey Manufacturing, PCB Assembly and New Product Introduction experts. Lean Manufacturing experts. QS9000 certified for Automotive manufacturing. Apple Computer certified for PC components manufacturing. ISO-9002 certified. Industrial and com
Our manufacturing capabilities allow us to support all aspects of the electronics manufacturing process. Our production processes include: High speed continuous flow SMT lines. High Mix SMT and PTH. Automated PTH assembly. Fine Pitch, BGA, CSP, C
New Equipment | Curing Equipment
Designed for Conformal Coatings and other Curing applications. LEL Protection. High Solvents, High Solids, Humidity Curing. High Volume Production. Large Area Filters. Reel to Reel Foil Drip liner and removable drip pans for easy maintenance. Convect
CAPABILITIES Top and bottom side Fine pitch BGA PCB Design and PCB Layout of Prototype builds Testing HP 3070 Checksum ICT MEC custom PCB Design and PCB Layout Functional and final test X-ray Special Processes Encapsulation (potting) Confo
Surface Mount Technology (with BGA's) Mixed Technology Through-Hole Technology Rigid, Rigid Flex, and Flex Circuit assembly Testing (functional, manual, troubleshooting), Flying Probe and ICT (outsourced) Conformal Coat Systems Integration and Box Bu
Surface Mount, Through Hole, or Mixed Technology on Single or Double Sided PWB assemblies BGA, CSP, components to 0402, Fine Pitch to 12 mils, 100% passive testing prior to placement. In-circuit programming, full functional testing and automated opt
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