New SMT Equipment: activation temperature (Page 2 of 11)

Cover Tape

Cover Tape

New Equipment | Tape and Reel Services

Plastlist Carrier Tape& Reel® Cover Tape Cover tape is sealed to the carrier tape to hold the devices in the pockets. Plastlist Carrier Tape& Reel® offers a full range of heat activated and pressure sensitive cover tapes to deliver desired

Plastlist Group

Kapp Copper-Bond Flux - High Temperature Soldering Flux

Kapp Copper-Bond Flux - High Temperature Soldering Flux

New Equipment | Solder Materials

Kapp Copper-Bond Flux™ has been designed for high temperature soldering of all common metals except Aluminum. Kapp Copper-Bond Flux™ is an activated liquid flux containing a mixture of inorganic salts in water, with approximately 50% active ingredien

Kapp Alloy & Wire, Inc

Partner Wire - Lead Free Solder Wires

Partner Wire - Lead Free Solder Wires

New Equipment | Solder Materials

DKL Metals offer a range of flux cored solder wires in a variety of alloy specifications including SN100C (SnCuNi), E-Qual 97TSC (SAC305), E-Qual 96TSC (SAC387), Alloy 23 (SnCu) and Alloy 28 (SnAg). A selection of our more popular products are detail

DKL Metals Ltd

Kapp Comet Flux - Low Temperature Soldering Flux

Kapp Comet Flux - Low Temperature Soldering Flux

New Equipment | Solder Materials

Kapp Comet Flux™ has been designed specifically for soldering all common metals except Aluminum. Kapp Comet Flux™ is an activated liquid flux, a mixture of inorganic salts in water, with approximately 35-40% active ingredients. Highly recommended f

Kapp Alloy & Wire, Inc

Kapp Lunar Flux - High Temperature Soldering Flux for Aluminum and Diecast

Kapp Lunar Flux - High Temperature Soldering Flux for Aluminum and Diecast

New Equipment | Solder Materials

Kapp Lunar Flux™ is a white paste for the high temperature soldering of Aluminum and Zinc die cast alloy. It is a reaction-type flux with 70% active ingredients dispersed in alcohol. Kapp Lunar Flux™ has considerable shelf life stability, as the susp

Kapp Alloy & Wire, Inc

Kapp Copper-Bond Flux 500°F - 750°F (260°C - 390°C)

Kapp Copper-Bond Flux 500°F - 750°F (260°C - 390°C)

New Equipment | Solder Materials

Flux designed specifically to work with KappZapp7, 7.0% Silver solder to remove the oxide layer on Copper to allow a strong metallic bond between the solder and the base metal. Its active range is 500°F - 750°F (260°C - 390°C). Kapp Copper-Bond Flux

Solder Direct

Lead Free Desktop Infrared  Reflow Oven 1816

Lead Free Desktop Infrared Reflow Oven 1816

New Equipment | Reflow

The R1816 infrared reflow oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the

HuiKe Tech

Desktop Reflow Oven R3028

Desktop Reflow Oven R3028

New Equipment | Reflow

Introduction This oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the tempe

HuiKe Tech

Desktop Reflow Oven R1825

Desktop Reflow Oven R1825

New Equipment | Reflow

This oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the temperature control

HuiKe Tech

IR-TS One Thermal Test System - Benchtop

IR-TS One Thermal Test System - Benchtop

New Equipment | Test Equipment

The PDR IR-TS One HALT/HASS Test System has been designed to thermally cycle key critical components and assemblies to detect defects. Using PDR’s unique Non-Destructive Dual Thermal Stress Screening Process, based on a variation on HALT/HASS princip

PDR-America


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