MLT provides laser services to remove unwanted squeeze-out from exposed metal pads, traces, and cavities. Squeeze-out can take the form of polyimide adhesives or prepreg resins. Whether a part of your standard manufacturing process or needed for re
New Equipment | ESD Control Supplies
Tacky Traxx Mats are the ultimate adhesive entrance mats designed to remove particulate from foot traffic, carts, and other objects before entering sensive electronic assembly areas, cleanrooms, laboratories, and other controlled environments. T
Designed to exceed the harsh environment requirements that are seen in applications used in electronics, electrical, automotive and aerospace. All materials are thermal transfer printable and exhibit the highest PCS and first read rates.Each label
New Equipment | Solder Paste Stencils
BGA Rework Stencils are now available direct to you and may be a major product improvement over what you are may be using now. FCT Assembly BGA Rework Stencils are designed to make your rework faster and cleaner. The materials used, design and precis
New Equipment | Cleaning Agents
LONOX® L5611 is a solvent-based cleaner for misprinted boards and stencils. It is effective on a wide variety of flux, solder paste and uncured adhesives. Easy to use, L5611 is intended to be diluted with water and effective at ambient temperature t
New Equipment | Cleaning Equipment
A Complete Stencil Cleaning Process - From One Source! Clean solder paste, adhesives and flux residue in one machine Two ultrasonic wash tanks eliminate cross contamination issues Safely clean solder paste at ambient temperature and othe
Sn/3.5Ag, Sn/0.7Cu, Sn/3.9Ag/0.6Cu, Sn/2.0Ag/0.7Cu (for Bar, Wire, Paste, BGA & Anode); Sn/Sb (for Bar); Sn (for Bar, Wire & Anode); Ni/Pd (for Bar, BGA & Anode); Conductive Adhesive (for Paste).
The MicroMesh Stencil System is a unique advanced stencil system explicitly designed and constructed to provide high precision in printing, especially when printing thicker deposits up to and in excess of 500 microns in height. Whether you are workin
The MicroMesh Stencil System is a unique advanced stencil system explicitly designed and constructed to provide high precision in printing, especially when printing thicker deposits up to and in excess of 500 microns in height. Whether you are workin
SIPAD Solid Solder Deposit (ssd) is a Siemens patented process that pre loads the pc board surface mount pads with solder in a solid form. Boards are printed, reflowed without components producing a predictable repeatable meniscus. SIPAD boards a
