Capabilities include: 1 to 20 layers, adhesive based or adhesiveless, 3 mil traces and spaces, 6 mil drilled holes, available in 3 days to 20 days
Performs pick and place, component placement, adhesive dispense, and flip chip operations.
General card design, component packages, equipment, component preparation, solder paste, stencil printing, component placement, reflow profiling, adhesives and all other related topics
Theory of adhesion, polymer families, physical and chemical properties of epoxies, urethane, silicones, conformal coatings, specifications, applications, properties, performance, curing mechanisms, thermal and UV curing, polymeric inspection, etc.
Stencils For Solder Paste Or Adhesive Printing. Chemically Etched, Laser Cut Or Combination Laser/Chem.
Consulting advanced assembly technologies. Barcode solutions on PCB's. Supplying special adhesives @ encapsulants VOC free flux, Solderpaste and environmental friendly cleaning solutions. Clean room setup and clean wear products.
Manufacturer of UV cure and thermally cured adhesives and coatings for the electronics, microelectronics industries
is a water-based cleaning medium utilizing our unique technology, designed to remove solder pastes and SMT adhesives from from PC boards, stencils, screens and mis-prints in heated and unheated spray-in-air and ultrasonic cleaning systems.
is a water-based cleaning medium, designed to quickly remove fluxes, solder pastes and SMT adhesives from PC boards, stencils, screens and mis-prints in heated and unheated spray-in-air and ultrasonic cleaning systems.
*Framed in cast aluminium or tubular *Metal only *Epoxy adhesive *Micro and Specialty *Multi-Level; step up/ step down *All stencils are laser cut and electropolished, and manufactured withing hours.
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