Specifications: 1.Overlay Materials: The most commonly used materials are polyester(PET) and polycarbonate(PC). 2. Rear Adhesive: 3M 467MP, 3M 468MP, etc. 3. Matching color: Pantone and RAL color matching system. 4 .Gloss, semi-gloss or matte 5
HTC-300 is designed for screen printing in flex circuit and printed electronic applications where stable resistance values at elevated temperatures are required. Utilizes a high Tg (glass transition temperature) thermoplastic copolymer binder fo
New Equipment | Cleaning Equipment
clean wiper roll are used to remove residual solder paste from the bottom side of PC Board stencils. Using Stencil Wiping Rolls prevents smearing, bridging, and solder balls caused by normal printing of solder paste onto PC Boards. Specifications:
New Equipment | Cleaning Equipment
The most advanced ultrasonic stencil cleaning system! Clean solder paste, adhesives and flux residue in one machine Easy loading / unloading only 39" H Uses less chemistry Generates less wastewater Increased ultrasonic cleaning e
CAT90-M is a manual pick and place system featuring the latest high resolution vision technology. The system is designed for placement of various SMT components such as capacitors, resistors, SOIC’s, fine-pitch QFP’s, and many other SMD’s. Components
New Equipment | Education/Training
Bob Willis has an extensive range of training videos available online. The complete video collection is available to view online for a fixed fee, based on a six month period. After purchase you are provided with links to each of the online videos for
ScanPLACE provides a sophisticated and user-friendly alternative to complex CAM software packages and inaccurate, time consuming manual inspection and programming methods that cost assembly houses productivity, time and money. Programming Using a
New Equipment | Cleaning Equipment
Industrial Plasma Cleaning System When plasma cleaning your product, whether it be small or large plastic parts, medical implants, wafers or electronic components, you will find that all are uniformly treated in the BT-1. Benefits to you are better
Eclipse Industries DS-107 Aligner Bonder The DS-107 Aligner Bonder is an ultra-high precision, high or low force aligner bonder. Constructed on a granite platform for superior stability and rigidity, the DS-107 is designed for alignment accuracy of
Mechatronic systems�s P20/P40 are flexible solutions for small and medium value series in the SMT-production. These machines were developed for assignments with claim for quick change of products, operating simplicity and reliability. Thanks to the
