New SMT Equipment: adhesion (Page 24 of 24)

MX2000IR - Wafer AOI

MX2000IR - Wafer AOI

New Equipment | Inspection

Highly Accurate Fully Automatic Wafer Inspection with Handling Unit For semiconductor assemblies, the requirement for a precise, thorough inspection for damage and defects during the production process is especially high. Wafers need non-destructive

Viscom AG

McDry Ultra-Low Humidity Storage Cabinets

McDry Ultra-Low Humidity Storage Cabinets

New Equipment | Board Handling - Storage

Prevent your components from micro-cracking during reflow with proper Ultra-Low Humidity Storage. DXU models of maintain1%RH Wide range of cabinets including UL/C models Conforms to IPC/JEDEC J-STD 033B.1 Dehumidifies ICs to prevent micro-crack

Seika Machinery, Inc.

ErgoSonic - Automatic / Closed loop Stencil & Pallet Cleaner

ErgoSonic - Automatic / Closed loop Stencil & Pallet Cleaner

New Equipment | Cleaning Equipment

The first ergonomicly designed front-loading ultrasonic stencil cleaner The ErgoSonic Model Stencil & Pallet Cleaner is fully automatic and programmable. The operator loads the stencil into an empty chamber and selects the desired cleaning profile.

Smart Sonic Stencil Cleaning Systems

ProtoFlow S - Lead-Free Reflow Oven

ProtoFlow S - Lead-Free Reflow Oven

New Equipment | Reflow

Ideal for in-house Rapid PCB Prototyping The ProtoFlow S is LPKF's premiere convection oven, ideal for lead-free reflow soldering, meeting the stringent demands of rapid PCB soldering applications. The ProtoFlow S features even heat distribution, e

LPKF Laser & Electronics

SEHO GoReflow - Compact Reflow Oven

SEHO GoReflow - Compact Reflow Oven

New Equipment | Reflow

Compact machine technology for small and medium-sized production series with convincing price-performance-ratio. Attractive Performance - Attractive Design - Attractive Price With a heating zone length of 1850 mm or 2350 mm the convection reflow

SEHO Systems GmbH

Tachyon®-100G Low-loss Laminate Material For High-speed Digital Applications

Tachyon®-100G Low-loss Laminate Material For High-speed Digital Applications

New Equipment | Materials

Tachyon-100G laminate materials are designed for very high-speed digital applications up to and beyond speeds of 100 Gb/s. Tachyon 100-G materials exhibit exceptional electrical properties that are very stable over a broad frequency and temperature

Isola Group

Henkel Chip-on-Board (COB) Encapsulants

Henkel Chip-on-Board (COB) Encapsulants

New Equipment | Materials

Henkel’s line of Loctite Hysol® and Loctite Eccobond™ encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. They are developed to provide protection to wire bonds, leads and alumi

Henkel Electronic Materials

IC670ALG230 Analog Input Current 8 Pt. Grouped

IC670ALG230 Analog Input Current 8 Pt. Grouped

New Equipment | Components

IC670ALG230 Analog Input Current 8 Pt. Grouped  IC670ALG240 Analog Input Current 16 Channel  IC670ALG620 RTD 4 Channel Isolated 3 wire  IC670ALG630 TC 8 Channel       IC670ALG310 Analog Output Voltage, 8 Channel, +/-10V, 0 to 10V  IC670ALG320 A

zhengzhou yuzhe electronic technology co.,ltd


adhesion searches for Companies, Equipment, Machines, Suppliers & Information

thru hole soldering and selective soldering needs

Software for SMT placement & AOI - Free Download.
consignment program

High Throughput Reflow Oven
PCB Handling Machine with CE

World's Best Reflow Oven Customizable for Unique Applications
Selective soldering solutions with Jade soldering machine

High Resolution Fast Speed Industrial Cameras.