1. The machine is designed for fast dispensing placement accuracy and repeatability without the expense for fast dispensing placement accuracy and repeatability ,even without the expense of coordinated X.Y moving ,it seamlessly integrates windows
30,000 dph High-Throughput Servo Motor Drive. The CHAMPION 3700 is a stand-alone automated fluid dispensing system for application of adhesives, solder pastes, sealants, lubricants, and other similar materials. The high-performance servo driven motio
Lite Fast A-1175 is a black, medical grade adhesive that cures within seconds after application of Ultraviolet light. Lite Fast A-1175 meets USP Class VI testing with extraction at 37�aC for 72 hours. Independent laboratories that are AALAC accredi
Eclipse Industries DS-107 Aligner Bonder The DS-107 Aligner Bonder is an ultra-high precision, high or low force aligner bonder. Constructed on a granite platform for superior stability and rigidity, the DS-107 is designed for alignment accuracy of
Appling Scope: The dispenser is suitable to dispense 1:1-3:1 A, B double-liquid adhesive precisely. It can also mix the liquid evenly. Key Features: 1. Have a big capacity cartridge, make the time of importing materials minimum, and
Our DA150 series are solvent-free and fast cure thermosetting electrical and thermal conductive die attach adhesives. DA150 has excellent adhesion to the substrate and bare die. It can be used for small and large die attach. Both dispense and printin
DA 90 is a silver filled, high thermal conductive, solvent-free and fast curing thermosetting die attach adhesives. DA 90 has excellent adhesion to the substrate and bare die. It can be used for small and large die attach. It can be applied using dis
CAT90-M is a manual pick and place system featuring the latest high resolution vision technology. The system is designed for placement of various SMT components such as capacitors, resistors, SOIC’s, fine-pitch QFP’s, and many other SMD’s. Components
The CAT90-SA pick and place systems are semi-automatic machines featuring software guidance and the latest high resolution vision technology. Systems are designed for placement of various SMT components such as capacitors, resistors, SOIC’s, fine-pit
The system is an optimal solution for hot glue applications. Hot melt, a thermoplastic adhesive perfectly changes its solid state to liquid when passing through the zones of increasing temperature; an ideal application for the electronic industry, e.
A Manufacturer of High Quality, Precision, Automated Fluid Dispensing and Conformal Coating Systems, SMT Cover Tape Peel Tester and Lead Forming machines for through-hole component preparation.
611 Hollingsworth Street
Grand Junction, CO USA
Phone: (970) 245-0408
.gif)
