Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
New Equipment | Education/Training
IPC standards, the results of industry consensus and collaboration, are respected throughout the whole world. Using IPC standards allows manufacturers, customers and suppliers to speak the same language. IPC standards are used by the electronics
New Equipment | Solder Paste Stencils
Sometimes there are products that come along and you think to yourself-Wow! The StikNPeel™ rework stencil is one of those products. It simplifies the rework of site locations by placing a highly flexible, removable, adhesive-backed stencil on to a ci
SIPAD Solid Solder Deposit (ssd) is a Siemens patented process that pre loads the pc board surface mount pads with solder in a solid form. Boards are printed, reflowed without components producing a predictable repeatable meniscus. SIPAD boards are t
Stencils For Solder Paste Or Adhesive Printing. Chemically Etched, Laser Cut Or Combination Laser/Chem.
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New Equipment | Cleaning Equipment
All kinds of printing or adhesive substrate before the surface activation, modification, grafting, roughening or cleaning. Application: ．LCM, IC Packaging (Flip Chip, CSP, BGA, Lead Frame, etc.), LED packaging, SMT, PCB, FPC, optoelectronic c
Epibond� 7275-Series surface mount adhesives offer excellent performance for all print and dispensing applications. Consistent high-dot profile and fast curing. Room temperature stability, 6-month room temperature shelf life. Non slumping and non st
As the first commercially available adhesive to address the emerging surface-mount market in the 1980s, Loctite Chip bonder and Eccobond products today are the industry standard for mixed-technology and double-sided surface mount technology (SMT) app
For die attach and general electronics assembly Die Attach Adhesives Zymet's electrically conductive die attach adhesives for semiconductor package assembly, hybrid IC assembly, COB IC assembly, and smartcard IC assembly. The adhesives are syring
General card design, component packages, equipment, component preparation, solder paste, stencil printing, component placement, reflow profiling, adhesives and all other related topics
