New Equipment | Soldering Robots
Description: Hot bar soldering is extremely effective in bonding components and parts that are dissimilar and difficult to unite. Several examples are listed above, but there are many other soldering situations that call hot bar reflow soldering sys
New Equipment | Soldering Robots
Microprocessor-based controller provides precise and consistent temperature control. Unique pulsed heat thermode offers uniform temperature distribution, fast heating and cool-down. Flexible programmable profiles for targeted idle, preheat and re
Hot Bar Soldering Machine Thermode Soldering Machine Hotbar Welding Machine Technical parameters: 1 Power supply: AC220V ± 10%, 50Hz, 3500W 2 Work environment :10-60 ℃, 40% ~ 95% 3 Working pressure: 0.5 ~ 0.7Mpa 4 Welding pressure: 2.5 ~
New Equipment | Soldering Robots
Benchtop Hot Bar Soldering Machine PCB Soldering Process For Flex Boards Microprocessor-based controller provides precise and consistent temperature control. Unique pulsed heat thermode offers uniform temperature distribution, fast heating and c
New Equipment | Rework & Repair Equipment
BEST HotDots™ are designed to simply and cleanly attach jumper wires on a board. HotDots™ are built to survive at high temperature as both the adhesive and the polyimide material are designed to withstand wash and reflow temperatures. HotDots™ are a
New Equipment | Solder Paste Stencils
Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o
New Equipment | Rework & Repair Equipment
The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
SIPAD Solid Solder Deposit (ssd) is a Siemens patented process that pre loads the pc board surface mount pads with solder in a solid form. Boards are printed, reflowed without components producing a predictable repeatable meniscus. SIPAD boards are t
General card design, component packages, equipment, component preparation, solder paste, stencil printing, component placement, reflow profiling, adhesives and all other related topics
