New Equipment | Solder Paste Stencils
Sometimes there are products that come along and you think to yourself-Wow! The StikNPeel™ rework stencil is one of those products. It simplifies the rework of site locations by placing a highly flexible, removable, adhesive-backed stencil on to a ci
New Equipment | Solder Paste Stencils
Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o
New Equipment | Rework & Repair Equipment
The BEST PCB Epoxy Repair Kit can be used to repair lifted pads and traces as well as build up and repair edge corner damage to PCBs or repair solder mask which has been damaged or removed. By adding colorants a pcb color epoxy kit can be made up cus
SIPAD Solid Solder Deposit (ssd) is a Siemens patented process that pre loads the pc board surface mount pads with solder in a solid form. Boards are printed, reflowed without components producing a predictable repeatable meniscus. SIPAD boards are t
New Equipment | Cleaning Equipment
Rapidly and effectively removes solder pastes, adhesives and flux residues. Completely air driven Misprint Cleaning System. Very simple and fast installation and operation. Board sizes up to 455 x 305mm - single vertical. Solder paste and flux re
New Equipment | Cleaning Equipment
Ultrasonic Stencil and Misprint Cleaning Systems Cleaning at the Speed of Sound Ultrasonic - Effective - Safe StencilWasher harnesses the power of sound waves to effectively remove raw solder paste and uncured adhesives from stencils, screens, and
New Equipment | Cleaning Agents
Chemicals & Cleaners from Loctite, Circuit Works, Chemtronics, JNJ, TechSpray, Excelta, Gordon, Menda, MicrCare, Kester, ACL, R&R, 3M, Edsyn, Hakko, OKI, Branson, Coventry, Desco, Kimberly-Clark, Puritan. Alcohol Brushes Contact Cleaners Degrea
BP 256 ball attach adhesives have been designed to enhance solder joint reliability and eliminate cleaning process for ball bumping process of CSP, BGA, Flip chip and PoP (package on package) and so on, particularly for lead free application. During
SMT256EP solderable adhesive is self-leveling and self-soldering adhesives, which has been designed for high temperature Pb-free application. By comparison with conductive adhesives (Ag), SMT256EP solderable adhesive has higher stable electrical and
SMT 256B series dip adhesives have been designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application. SMT 256B is a kind of polymer adhes
