Thermally conductive silicone adhesive sealant. 1-Part RTV, neutral cure, fast cure, fast on-set of adhesion for PC board & component heat sink, part fixturing, vibration & moisture insulation, as well as the adhesive sealing of components.
New Equipment | Cleaning Equipment
Precision Fine Pitch Aperture Cleaners Thousands of dollars less than fully-automatic cleaners Low solvent usage and running costs Fast cleaning time of 1-3 minutes Minimal waste disposal Portable unit can be used directly on the screen printe
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
IC670ALG230 Analog Input Current 8 Pt. Grouped IC670ALG240 Analog Input Current 16 Channel IC670ALG620 RTD 4 Channel Isolated 3 wire IC670ALG630 TC 8 Channel IC670ALG310 Analog Output Voltage, 8 Channel, +/-10V, 0 to 10V IC670ALG320 A
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