New SMT Equipment: adjustment tool (Page 1 of 17)

Precision Lead Former for Axial Components (CF-8)

Precision Lead Former for Axial Components (CF-8)

New Equipment | Lead Forming

Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s

GPD Global

Lead Former for Bulk or Loose RADIAL Components (CF-10)

Lead Former for Bulk or Loose RADIAL Components (CF-10)

New Equipment | Lead Forming

Form & Cut 2-, 3-, 4-, 5-, and 7-leaded Radial Components Capable of forming loose radial components at rates up to 5,000 parts per hour with a variable speed motor. Feed components by hand or with tubes (TO-220s) Reduce setup time with quick ch

GPD Global

High Precision Dispenser - MAX II (Heated Dispenser)

High Precision Dispenser - MAX II (Heated Dispenser)

New Equipment | Dispensing

Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl

GPD Global

High Precision Dispenser - MAX Series (Non-Heated)

High Precision Dispenser - MAX Series (Non-Heated)

New Equipment | Dispensing

High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En

GPD Global

Large / Versatile Board Processing - DS Series Dispenser

Large / Versatile Board Processing - DS Series Dispenser

New Equipment | Dispensing

When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste

GPD Global

N200 - Depaneling Punch for Round Tab Routed Boards

N200 - Depaneling Punch for Round Tab Routed Boards

New Equipment | Depaneling

Low Cost Punch For Singulation Small Tab Routed Panels N200 singulates one tab at a time with upper and lower pinch blades. Singulate curve routed and odd shaped boards. Top and bottom knife set cuts tabs cleanly. Minimal stress on PCB. Toolin

FKN Systek

99-0012 - Pin Grid Array Extractors

99-0012 - Pin Grid Array Extractors

New Equipment | Rework & Repair Equipment

Pin Grid Array Extractors are available in two sizes and provide a quick and safe way to extract Pin Grid Array components from their sockets. All component sizes can be accommodated, as the tool is available in two or four grip models. Adjusting the

FKN Systek

FKN Systek K3000 - Manual Circular-Linear Blade PCB Depanelizer

FKN Systek K3000 - Manual Circular-Linear Blade PCB Depanelizer

New Equipment | Depaneling

FKN Systek K3000 - Singulate scored and skip scored panels up to 24" long ESD protective mat on back table Adjustable front and back support table Singulate panels with components up to 2.5" high Available in 18" blade (standard) or 24" blade (

FKN Systek

C200 Pneumatic Crimp Tool

C200 Pneumatic Crimp Tool

New Equipment | Cable & Wire Harness Equipment

Low Cost Table Top Crimp Machine. The C 200 is a table top low cost crimp tool which takes a variety of dies from different manufacturers. Air operated using standard factory air (5 bar min), with a pressing capacity of up to 1,200 kp, this portable

FKN Systek

R100 Benchtop PCB Depaneling Router

R100 Benchtop PCB Depaneling Router

New Equipment | Depaneling

Safely Singulate Tab Routed Panels - With Dust Extraction Finish routing a tab routed PCB for singulation is a relatively slow process . However, in some cases, where the board contours and sensitive or overhanging components may require, this may b

FKN Systek

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2024 Eptac IPC Certification Training Schedule

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2024 Eptac IPC Certification Training Schedule

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Low-cost, self-paced, online training on electronics manufacturing fundamentals