Oak-Mitsui has developed a novel thin substrate, FaradFlex�, which is the next generation of Buried Capacitance material. Buried Capacitance utilizes the technology of putting a capacitor plane inside the PCB to reduce the overall impedance of the po
This high efficiency unit is capable of a wide range of consumer or industrial applications. High Performance and Cost Effective, Flexible Changeover and Capable of M/L size PWB's for Flexibility, Optional PCB support up to 27.6" X 16" or 20" X 18",
We specialize in manufacturing electronic packaging materials such as SMT tape SMD tape Top cover tape carrier tapes. We have new and advance technology so our products have many advantages. We got the certificate of SGS and ISO9001. Plz feel free t
Requiring a combination of leading-edge technologies, proven expertise and experience, effective board layout is the foundation of a successful product. At NBS, we utilize the very latest technologies such as Cadence� Allegro� and Valor� software to
Sunshine manufactures the most advanced stencils powered by LPKF's laser Technology. By combining our experience with the newest technology, we produce unrivaled results Laser stencil specifications: Resolution 0.5 mm Axial Precision �4μm
1. May realize the two component liquid Automatic ratio, automatic mixing and automatic dispensing according to the procedure in advance 2. The feeding system quote large-capacity storage system can continuous feed material, the mixing end cleani
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• Program Development and Delivery - Quality 5DX/x6000 automated X-ray inspection to uncover even marginal defects • Training - Basic and advanced training for programmers and repair operators • Component Testability - Determine the X-ray testab
BQC (BEST QUALITY CONTROL) is our mission, we could provide our customers PCBA with high-quality and excellent after-service which could save your money and cut down your expenditures. we own advanced manufacturing technology with latest equipment wh
XJLink and XJLink2 are small, portable, USB hardware devices that provide a high speed interface (480Mbps) to the JTAG chain on a circuit board. The small, lightweight design means the XJLink or XJLink2 can easily be moved to the Unit Under Test (UUT
