Thousands of designs including a full line of test emulator adapters.
Wide variety of styles including Peel-A-Way� low profile removable carrier, high density molded connectors, and more. Patented features such as solder preforms and screw-machined terminals offer high reliability.
Hundreds of standard and interstitial footprints. Many terminal and wafer options including Peel-A-Way� low-profile, removable carriers and high temperature molded wafers.
Three solutions for virtually any application. BGA Socket Adapter Systems featuring eutectic solder balls and footprints which match BGA device are designed for high volume production applications. Pop-Top� Socket Adapter Systems features integral he
Mapletech Group core technology and advanced capabilities are driven by our focus on fabricating complex and cutting edge High Density Interconnect (HDI) PCB's. Through our endless effort, we can meet any design requirement of the small form factors
Parmod�, Parelec Inc�s patented conductive ink technology, enables the formation of continuous-phase pure metallic conductors at relatively low temperature�making them suitable for application to polymer substrates. Parmod� inks, pastes and toners ca
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