New SMT Equipment: advanced thermal (Page 1 of 6)

SMT Assembly Middle Size Hot Air Lead Free Reflow Oven

SMT Assembly Middle Size Hot Air Lead Free Reflow Oven

New Equipment | Reflow

Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Full Hot Air Lead-Free Reflow Oven with PLC A800

Full Hot Air Lead-Free Reflow Oven with PLC A800

New Equipment | Reflow

Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Advanced Thermal Management

Advanced Thermal Management

New Equipment | Assembly Services

S-Bond® solders are unique in their ability to provide a high performance thermal joint between these materials. S-Bond materials offer approximately 10 times the thermal conductivity of most thermal epoxies along with the ability to bond in air with

S-Bond Technologies

Straight Fin BGA Heat Sinks

Straight Fin BGA Heat Sinks

New Equipment | Other

Straight Fin BGA Heat Sink (High Aspect Ratio Ext.) High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments Fabricated from extruded aluminum, which minimizes thermal resistance from the base to the fins, reduc

Advanced Thermal Solutions, Inc

Slant Fin BGA Heat Sinks

Slant Fin BGA Heat Sinks

New Equipment | Other

Slant Fin BGA Heat Sink (High Aspect Ratio Ext.) Features a low profile, slant fin array that offers many of the performance benefits of maxiFLOW™ at a great value Fabricated from extruded aluminum, which minimizes thermal resistance from th

Advanced Thermal Solutions, Inc

Custom Pin Fin BGA Heat Sinks

Custom Pin Fin BGA Heat Sinks

New Equipment | Other

BGA Heat Sink (High Aspect Ratio Ext.) High efficiency pin fin design provides low pressure drop characteristics Large surface area increases heat sink performance Fabricated from extruded aluminum, which minimizes thermal resistance fro

Advanced Thermal Solutions, Inc

New ACCULOGIC PCB Testers

New ACCULOGIC PCB Testers

New Equipment | Test Equipment

ACCULOGIC: Flying Probe System, Boundary Scan Solutions Scorpion Single and Double Sided Flying Prober Analog, Digital, Mixed Signal and Boundary Scan Capabilities Advanced Laser, Optical and Thermal Measurement Testing ScanProbe, Ch

WittcoSales, Inc.

BWT-104 Benchtop Wind Tunnel

BWT-104 Benchtop Wind Tunnel

New Equipment | Other

The BWT-104WA is a research quality, open loop, benchtop wind tunnel for thermal characterization of components, circuit boards and cooling devices such as heat sinks, heat exchangers and cold plates. The polynomial shape and internal flow management

Advanced Thermal Solutions, Inc

TGP 110 Thermal Conductive Adhesives

TGP 110 Thermal Conductive Adhesives

New Equipment | Materials

Our TGP110 thermal conductive adhesives is a series of reactive thermal grease with very thin BLT that eliminates micro-bubbles at the rough interface when applied. In service time, it can be cured to form thermal gel or thermal pad but with the perf

YINCAE Advanced Materials, LLC.

Advanced Converting Inc.

New Equipment |  

We provide: Kapton tapes and dots, conformal coating tapes, high temp thermal transfer labels , thermal management pads, electrical insulators, custom fabricated gaskets and emi rfi shielding diecut parts. Please call (480) 968-6631

Advanced Converting Inc.

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