New Equipment | Soldering Robots
I.C.T SR530 Desktop Automatic Laser XYZ Soldering Robot The I.C.T SR530 is a high-precision desktop automatic laser soldering robot designed for PV module manufacturing and other high-reliability soldering applications. This advanced system integrat
New Equipment | Soldering Robots
I.C.T SR530 Desktop Automatic Laser XYZ Soldering Robot The I.C.T SR530 is a high-precision desktop automatic laser soldering robot designed for PV module manufacturing and other high-reliability soldering applications. This advanced system integrat
New Equipment | Soldering Robots
I.C.T SR530 Desktop Automatic Laser XYZ Soldering Robot The I.C.T SR530 is a high-precision desktop automatic laser soldering robot designed for PV module manufacturing and other high-reliability soldering applications. This advanced system integrat
Product Description: The Laser Depaneling Machine is an innovative online or offline PCB laser depaneling equipment with extraordinary cut quality holding tolerances down to as small as 50 microns. It features a powerful Optowave laser with a wavele
Semi Automatic Manual Liquid Dispenser Machine For Mobile Screen Automobile mechanical parts coating, cell phone buttons point glue, mobile phone battery packaging,laptop battery packaging, the coil point glue, PCB bonding/ sealing, IC bonding/
New Equipment | Rework & Repair Services
Your BEST Source For High Quality Industry-Leading BGA Repair Service BEST provides industry-leading solutions for Ball Grid Array BGA Repair Services and other grid array device reworks. Our engineers have developed better processes to make our BGA
New Equipment | Test Equipment
ACCULOGIC: Flying Probe System, Boundary Scan Solutions Scorpion Single and Double Sided Flying Prober Analog, Digital, Mixed Signal and Boundary Scan Capabilities Advanced Laser, Optical and Thermal Measurement Testing ScanProbe, Ch
Straight Fin BGA Heat Sink (High Aspect Ratio Ext.) High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments Fabricated from extruded aluminum, which minimizes thermal resistance from the base to the fins, reduc
Slant Fin BGA Heat Sink (High Aspect Ratio Ext.) Features a low profile, slant fin array that offers many of the performance benefits of maxiFLOW™ at a great value Fabricated from extruded aluminum, which minimizes thermal resistance from th
BGA Heat Sink (High Aspect Ratio Ext.) High efficiency pin fin design provides low pressure drop characteristics Large surface area increases heat sink performance Fabricated from extruded aluminum, which minimizes thermal resistance fro
Nordson Electronics Solutions makes reliable electronics an everyday reality. Our ASYMTEK, MARCH, and SELECT brands deliver precision fluid dispensing, conformal coating, plasma treatment and selective soldering equipment.
2762 Loker Ave West
Carlsbad, CA USA
Phone: 18002796835