70 inches (180cm) heated length 30 inches (79cm) cooling length 4 Preheat Zones 1 Reflow Zone 3 Cooling Zones. The Cureflow Series offers Near Equilibrium Heating, also known as "Long Nozzle Hot Gas Heating", a method wherein the hot air or gas temp
High quality with low price, Yeefung is your best choice. FEATURES 1.Adopt English Windows 2000 operation system. The dependability is high; the speed is quick. It is easy to manage, and can connect Internet. 2.Centering support and chains convey
First of all, It is so pleasure to contact your company We,TSM soldering machinery,are looking for distributor covering regional country for ele/semicon.industrial assembly application Let us introduce ourself shortly,if you can share business oppor
All in One N2 Reflow Oven. A next generation reflow oven that realizes ultra-low power consumption, the lowest N2 consumption and a high efficiency flux collecting system complying CO2 emission regulations. N2 Generator Fixing Type Easy M
New Equipment | Solder Materials
8 hours), and abandon time (>4 hours) Printing: Suitable for high speed printing up to 150 mm/s Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection Careful contr
Convection reflow oven for PCBs with 5 zones on top and five bottom vertical heating zones, the NEW GF-125 HC/HT is an economic solution for automatic medium volume production runs. Utilizing horizontal convection heating technology, the GF-125 HC/H
New Equipment | Rework & Repair Equipment
The AT-707 series BGA Rework Stations are semiautomatic machines featuring spilt vision optics and precise software process control. Systems are used to rework various devices such as BGA’s, CSP’s, QFN’s, QFP’s, and other complex SMD’s in both Lead-F
New Equipment | Board Handling - Storage
Prevent your components from micro-cracking during reflow with proper Ultra-Low Humidity Storage. DXU models of maintain1%RH Wide range of cabinets including UL/C models Conforms to IPC/JEDEC J-STD 033B.1 Dehumidifies ICs to prevent micro-crack
The Sniper III is the latest in BGA and Micro BGA Rework system design. With On-Board control and powerful computer profile generation, including data logging. The system also includes a Thermalcouple Bank to develop the rework profile and monitor th
A: Temperature control segment: 40 segment The segment can be set in computer according to the actual requirement. B: Temperature-zone numbers : Single-zone and multi-segment C: Temperature control system�� PC control system ,SSR non-contact output
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