The SUSS MicroTec MA100RR Reel-to-Reel Proximity Mask Aligner is specifically designed for volume production of tape for tape carrier packages (TCP) and flex based chip scale packages (CSPs), like the �BGA. The tool can also be used for products requ
(AutoTronik) BS1400 is a very accurate automatic SMT stencil printer. With the powerful AT-align automatic fiducial finding and PCB board offset adjustment system, you can just press the start key, the PCB alignment and printing process will be fully
Product Name: SMD Cutting Tool Model Number: F0382 Place of Origin: China Features: 1) Unique slip-n-snip design, perfect for trimming carrier tapes 2) Carrier tape alignment tool is for greater accuracy in splicing with the tape splicing tool 3
Product Name: SMD Cutting Tool Model Number: F0382 Place of Origin: China Features: 1) Unique slip-n-snip design, perfect for trimming carrier tapes 2) Carrier tape alignment tool is for greater accuracy in splicing with the tape splicing tool 3
TAB Excise Tooling. This tooling will excise 35, 48 and 70mm TAB devices to Customers Specifications. The Tooling is Self-Aligning and Quick Change. And will fit into any of our Vertical Access Presses.
TAB Excise and Form Tooling. This tooling will excise and form TAB devices to customers specifications. This tooling is self aligning and quick change and will fit into any of our Vertical Access Presses. This tooling incorporates a keeper bar cla
New Equipment | Rework & Repair Equipment
The X-1 Precision SMT/BGA Rework Station is a flexible system designed for manual alignment and placement or removal of BGA, microBGA, Flip Chip, CSP and other surface mount electronic components with precisely controlled solder reflow profiles. The
Standard or Lead Free models available Solder/desolder capabilities PCB Board carrier Hot AIr Blow Through Gun Laser alignment Misc nozzle sizes
Eclipse Industries DS-107 Aligner Bonder The DS-107 Aligner Bonder is an ultra-high precision, high or low force aligner bonder. Constructed on a granite platform for superior stability and rigidity, the DS-107 is designed for alignment accuracy of
SUSS MicroTec's newest product offering is a 300 mm lithography cluster which consists of an MA300 mask aligner module linked to an ACS300 spin-coating system. LithoPack300 (LP300) is specifically designed for wafer bumping and wafer level packaging
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