New SMT Equipment: aligner (Page 4 of 15)

SP210avi 23

SP210avi 23

New Equipment | Printing

While bringing a fresh new look to the SP210avi the printer still retains it's reputation as the smallest printer in the market with the highest level of capability and quality. Developed as a flexible fine pitch Printer the SP210avi is ideal in

Speedprint Technology

FiberMax Photonics Alignment System

FiberMax Photonics Alignment System

New Equipment | Other

Up to six axes of precise motion Noncontact direct-drive for all axes 2.5 nm resolution X-Z axis 2 nm resolution Y axis Direct-drive rotary axes, T-P-R 0.027 to 0.058 arc second resolution on all rotary axes 32-axis turnkey dr

Aerotech, Inc.

HEPCO 9400-1 BGA Solder Sphere Placement System

HEPCO 9400-1 BGA Solder Sphere Placement System

New Equipment | Pick & Place

The Model 9000 operates using a self-contained vacuum system to secure the BGA component while transferring the desired pattern of solder sphere's in a full array. Alignment is achieved through precision pins and specific tooling for ease of use, re

HEPCO, Inc.

TG-1000 Hot Bar Bonding System for Larger Displays or Substrates

TG-1000 Hot Bar Bonding System for Larger Displays or Substrates

New Equipment | Assembly Services

TG-1000 Hot Bar Bonding System TG-1000 is a feature rich, floor standing bonding system designed for process development and high mix production environments. Standard features include: • Floor standing base frame & leveling legs with righ or left

Toddco3

Yamaha YSP High-speed, High-precision Printer

Yamaha YSP High-speed, High-precision Printer

New Equipment | Printing

Applicable to large size PCB L510 × W460. Ideal printing condition by 3S head.(3S: Swing Single Squeegee) High speed printing ability: Line tact 11.0 sec. Capable of fine adjustment for printing alignment parameter by Graphical layer base

Yamaha Motor IM America, Inc.

Virtual Panel Tooling

Virtual Panel Tooling

New Equipment | Software

Virtual Panel Tooling provides just that: dozens of substrates are independently aligned, simultaneously, creating a virtual panel ready for imaging in a single cycle. This concept delivers high throughput comparable to processing panelised substrate

ASM Assembly Systems (DEK)

Wafer Level Chip Scale Marker : CSM 2000

New Equipment |  

User friendly operating software, Ultra stable diode-pumped Nd :YAG green laser, Support Wafer Size : 4,5,6 & 8" wafers, option : 8 to 12" wafers, Absolutely free from damage on the fabricated wafer, High accurate marking position alignment using th

EO Technics Co., Ltd.

DEK VIKING

DEK VIKING

New Equipment |  

The Viking delivers access to added value features and advanced options never before available in semi-auto formats including fully automatic vision alignment, the DEK adjustable stencil mount, ProFlow and 2D inspection. Stencils up to 29" x 29" can

DMcRoy ltd.

NPI and Prototype Services

NPI and Prototype Services

New Equipment | Design Services

NPI is a vital cross-functional business process with a clear focus on engineering and the application of new technology. A successful NPI demands that integration of the product design and the development processes are aligned with the company’s bus

Absolute Turnkey Services Inc,

EKRA M2H - Entry-Level Screen Printer

EKRA M2H - Entry-Level Screen Printer

New Equipment | Printing

Semi-Automatic Screen Printer The M2H semi-automatic screen printer has been designed for printing of ceramic hybrids in applications with small to medium size production volumes, R&D and laboratory as well as prototyping purposes. But also a lar

ASYS Group


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