New Equipment | Solder Materials
Tip tinner to aid in cleaning and re-tinning solder iron tips de-wetted by use which can’t be repaired with sponge pads and cored solder wire. Use of TTC100C LEAD FREE Tip Tinner offers the following advantages: Lead Free SN100C tin/copper/nic
Ceramic & Glass to Metal Sealing Alloys in Strip/Coil, Sheet, Rod & Plate. Kovar, Invar, Alloy42,...
New Equipment | Solder Paste Stencils
Laser Fab, NiPlate™, NanoCoat™. NicAlloy-XT™ stencils are the premier laser-cut stencils in the industry. Beginning life as a laser-cut stencil, followed by a secondary process utilizing Photo Stencil’s own proprietary NiPlate™ technology, which fur
New Equipment | Assembly Services
S-Bond has been licensed as a supplier and provider of ultrasonic activated joining services using EWI SonicSolder®, an EWI patented* binary lead-free solder alloy that melts at 231°C. In conjunction with ultrasonic soldering, it can be used to join
Reflow hot plate used for a variety of heating applications which include preheat, rework, reflow and curing of printed circuit board assemblies. The GF-DL-HT is capable of lead and lead free, high temperature applications and has dual programmable,
New Equipment | Solder Materials
KappAloy9™ - 91%Sn - 9%Zn - 390°F (199°C) eutectic alloy is the best solder for soldering Aluminum wire to Copper busses or soldering Copper wire to Aluminum busses or contacts. Its low eutectic melting point minimizes heating of critical electrical/
New Equipment | Solder Materials
AMTECH’s Tacky Paste Fluxes (TF) are designed to meet and exceed industry standards. TFs are used for general touch-up and rework of PCBs, and for the attachment of spheres to BGA and mBGA packages. Operations such as soldering Flip Chip components t
The heating surfaces of the precision hot plates are composed of an efficient heat conducting Aluminum alloy, and have a smooth anodised finish for easy maintenance. The electrical long-term heating ensures that the temperature remains constant, even
New Equipment | Education/Training
The areas in which we are conducting research comprise a comprehensive group of inter-related issues and concerns involving all military, industrial and commercial electronics users facing conversion to lead free solder alloys. REI’s DoD currently
New Equipment | Solder Materials
By combining our latest wire and alloy technologies with SN100c, FCT Assembly has an advantage over all other suppliers in paste, wire and flux. Product Attributes No Clean Wat
