New SMT Equipment: alpha and issues (Page 2 of 2)

LPKF Flex Cutting and Depaneling Systems

LPKF Flex Cutting and Depaneling Systems

New Equipment | Depaneling

When time to market is the driving force, fast alternatives to pilot production runs can be the key to success. LPKF UV laser systems provide the flexibility, reliability and high precision that customers demand. By reducing product changeover time

LPKF Laser & Electronics

E-Business - ERP, SCM and CRM - Consulting, Training and Certification Programs

E-Business - ERP, SCM and CRM - Consulting, Training and Certification Programs

New Equipment | Education/Training

The first rule of any technology used in a business is that automation applied to an efficient operation will magnify the efficiency. The second is that automation applied to an inefficient operation will magnify the inefficiency - Bill Gates E-Bus

eXample Consulting Group

Design and Manufacturing with SMT Surface Mount Technology

New Equipment |  

The objective of this course is to identify the technical issues in Through hole, SMT, BGA and fine pitch technology design and manufacturing that must be resolved for an effective implementation of mixed assembly electronics products. The course mat

Ray Prasad Consultancy Group

LONOX® L5611 - Stencil and Misprinted Board Cleaner

LONOX® L5611 - Stencil and Misprinted Board Cleaner

New Equipment | Cleaning Agents

LONOX® L5611 is a solvent-based cleaner for misprinted boards and stencils. It is effective on a wide variety of flux, solder paste and uncured adhesives. Easy to use, L5611 is intended to be diluted with water and effective at ambient temperature t

KYZEN Corporation

Lead Free Technology For Electronic Assemblies Problems and Promises

New Equipment |  

Transition to Lead free will impact almost everyone in the electronics industry whether you consider yourself RoHS exempt or not. This is not a theoretical course. The objective of this course is to show you how you can resolve the business and techn

Ray Prasad Consultancy Group

TherMoiré® AXP - Thermal Warpage and Strain Measurement Tool

TherMoiré® AXP - Thermal Warpage and Strain Measurement Tool

New Equipment | Test Equipment

3D Deformation Measurement with Akrometrix TherMoiré and Digital Fringe Projection. Akrometrix' patented TherMoiré systems are the industry leading tools for advanced characterization of temperature-dependent warpage. First introduced in 1998 for us

Akrometrix

GC-PowerPlace™ - Create Pick and Place, ICT, AOI Programs from Gerber

GC-PowerPlace™ - Create Pick and Place, ICT, AOI Programs from Gerber

New Equipment | Software

Graphical CAM software for captive and contract PCB assemblers. GC-PowerPlace accepts Gerber data along with an ASCII BOM file to create and verify assembly equipment programs off-line. Centroids are extracted with sub-micron precision. It can also c

Graphicode

HDI Instrumentation IPS-6000 / SRA-FA Hard DiskSurface Reflectance Analyzer and Controller

HDI Instrumentation IPS-6000 / SRA-FA Hard DiskSurface Reflectance Analyzer and Controller

New Equipment | Inspection

HDI SRA-FA Surface Reflectance Analyzer Product Description Used, good physical condition, HDI Instrumentation UPC-8000 / SRA-FA Surface Reflectance Analyzer and Controller. Acutal item shown, sold as pictured. Unit powered up but software password

SurplusEQ

Wentworth Labs 0-23-0002 Manual Probing Station with (2) 001-1122 Probes and CCD

Wentworth Labs 0-23-0002 Manual Probing Station with (2) 001-1122 Probes and CCD

New Equipment | Inspection

Wentworth Probe Station with 2 probes, 105mm vacuum plate, 4 objectives, color digital camera and vacuum pump. This analytical manual probing station is in very good physical condition. It features X, Y, Z and rotational capability on the sample

SurplusEQ

ShenZhen electronic components and circuit board PCB assembly with SMT Assembly PCBA Services

ShenZhen electronic components and circuit board PCB assembly with SMT Assembly PCBA Services

New Equipment | Assembly Services

No. Items technological Capability 1 Layer 1-20 layer 2 Copper thickness 0.5-4.0oz 3 Board thickness 0.2mm-6.0m

Shenzhen Sunsoar Circuit Co.,Ltd

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