New SMT Equipment: aluminum bond pull strength (Page 1 of 2)

USB Tweezers

USB Tweezers

New Equipment | Test Equipment - Bond Testers

Many bond strength tests require a means to grip the part so that the strength of its bond can be tested. In many of these applications the geometry and force of the grip must be precisely controlled to ensure sufficient load can be applied to the bo

XYZTEC bv

Bondjet BJ931 - High Speed Fully Automatic Dual-Head Wedge Bonder

Bondjet BJ931 - High Speed Fully Automatic Dual-Head Wedge Bonder

New Equipment | IC Packaging

The Bondjet BJ931 High Speed Fully Automatic Dual-Head Wedge Bonder meets the latest technology and flexibility demands for automotive and power electronics applications, handling thin and heavy aluminum, copper and gold wire and ribbon on two specia

Hesse Mechatronics

EWI SonicSolder

EWI SonicSolder

New Equipment | Assembly Services

S-Bond has been licensed as a supplier and provider of ultrasonic activated joining services using EWI SonicSolder®, an EWI patented* binary lead-free solder alloy that melts at 231°C. In conjunction with ultrasonic soldering, it can be used to join

S-Bond Technologies

NanoFoil® Multi-Layer Bonding Material

NanoFoil® Multi-Layer Bonding Material

New Equipment | Materials

NanoFoil® reactive multi-layer foil is a controllable and affordable bonding material, proven to lower manufacturing costs while providing repeatable and reliable bonds. NanoFoil® is a reactive multi-layer foil that provides instantaneous heat for

Indium Corporation

Condor Sigma Bond Tester

Condor Sigma Bond Tester

New Equipment | Test Equipment - Bond Testers

The Condor Sigma is the most advanced bond tester on the market, combining the unique strengths of the Condor series with the latest technologies and innovations. Full automation, 0.075% accuracy, best ergonomics, highest throughput, vision options,

XYZTEC bv

PE-200 Plasma Etching Benchtop System

PE-200 Plasma Etching Benchtop System

New Equipment | Prototyping

The PE-200 is our industrial strength bench top plasma etching system and supplied with an oxygen service vacuum pump. This robust, reliable and yet quite affordable system was developed for the busy 24/7 manufacturing firm that cannot have downtime.

Plasma Etch, Inc.

IONOX® FCR - High Strength Semi-Aqueous Electronics Cleaner

IONOX® FCR - High Strength Semi-Aqueous Electronics Cleaner

New Equipment | Cleaning Agents

IONOX® FCR is a solvent blend designed for removing rosin, low solids and water soluble fluxes while being environmentally friendly. Easy to use, FCR is applied as received. A water rinse is required to remove all traces of soils and cleaner residues

KYZEN Corporation

Passive SMD Magnetic Buzzer ab epoxy potting machine

Passive SMD Magnetic Buzzer ab epoxy potting machine

New Equipment | Dispensing

Passive SMD Magnetic Buzzer ab epoxy potting machine Product Description 2 component polyurethane injection resin machine dispensing machine for pu compound Where to buy PU , epoxy bonding machine ? We Daheng Automation specialize in different ty

Guangzhou Daheng Automation Equipment Co.,LTD

Henkel Chip-on-Board (COB) Encapsulants

Henkel Chip-on-Board (COB) Encapsulants

New Equipment | Materials

Henkel’s line of Loctite Hysol® and Loctite Eccobond™ encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. They are developed to provide protection to wire bonds, leads and alumi

Henkel Electronic Materials

GE Bently Nevada  109548-01 P1407030-00100  Proximity Probe

GE Bently Nevada 109548-01 P1407030-00100 Proximity Probe

New Equipment | Industrial Automation

  Sandy.[mailto:unity@mvme.cn]    Sandy.[WhatsApp/Skype/Mobile:+8618020776786]     Sandy.[Quote to you within the shortest possible time with our best price]   Warranty: up to 12 months Shipping: fast delivery is available NEW+ORIGINAL+IN STOCK+ONE

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

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