Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
New Equipment | Assembly Services
BEST can provide you with analysis services for your BGAs using x-ray equipment. We rework thousands of BGAs and POPs every year, therefore, we have the expertise in BGA X-ray inspection. BEST can be your outsourced BGA x-ray inspection source for o
New Equipment | Test Equipment
slim kic 2000 reflow oven thermal profiler temperature Curve analyzer Product description: slim kic 2000 reflow oven thermal profiler temperature Curve analyzer INQUIRY slim kic 2000 reflow oven thermal profiler temperature C
slim kic 2000 reflow oven thermal profiler temperature Curve analyzer reflow oven thermal profiler temperature Curve analyzer slim kic 2000 reflow oven thermal profiler Product description: slim kic 2000 reflow oven thermal profiler tem
New Equipment | Test Equipment
IN-CIRCUIT TESTER PMP-818S Feature ▶Phase measurement technology ▶Optocoupler measurement technology ▶Current measurement technology ▶Multiple points measurement ▶Isoelectric separation point automatically ▶High voltage detecting and discharging te
New Equipment | Rework & Repair Equipment
PMP-500 First Article Tester V2.0 PTI-500 First Article Inspection Tester Overview PTI-500 First Article Inspection Tester is mainly used for the first article inspection of the SMT production process in electronics factories. The operation of the t
Dual Lane SMT Reflow Oven Nitrogen soldering process dual rail conveyor Weight Appx.:3060Kg Dimension 6300*1680*1530mm Product description: 10 Zones Dual Rail Nitrogen SMT Reflow Oven KTR-1000D-N Manufacturer, Nitrogen soldering process, dual
New Equipment | Rework & Repair Equipment
BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! For high volume BGA Rework on even the largest computer and networking boards! The model SV560A has a high resolution optical system for pla
New Equipment | Test Equipment
KOH YOUNG ZENITH 2 3D AOI 8 directional projection light system Camera resolution: 8M 15μm maximum Height measurement: 10 mm Max PCB 490 x 510 mm weight: 600kg Dimension: 1000x1295x1627 mm KOH YOUNG ZENITH 2 3D AOI KOH YOUNG ZENITH 2 3D AOI R
New Equipment | Test Equipment
Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:
