New SMT Equipment: aoi high mix (Page 13 of 19)

FR4 Multilayer PCB Manufacturer

FR4 Multilayer PCB Manufacturer

New Equipment | Fabrication Services

Specifications: Size (L x W): 50 x 50 to 700 x 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74x74mm Service include: PCB layout and BOM design or

Shenzhen Aobo Technology Co.,Ltd

PCB Fabrication with RoHS, 100% test

PCB Fabrication with RoHS, 100% test

New Equipment | Fabrication Services

Specifications: Applicable PCB (L x W): 50 × 50 to 700 × 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74 x 74mm Services include: PCB layout and

Shenzhen Aobo Technology Co.,Ltd

HASL PCB Manufacturer

HASL PCB Manufacturer

New Equipment | Fabrication Services

Specifications: Applicable PCB (L x W): 50 × 50 to 700 × 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74x74mm Service include: PCB layout and BOM

Shenzhen Aobo Technology Co.,Ltd

SEHO PowerSelective - Maximum Flexibility Selective Soldering Machine

SEHO PowerSelective - Maximum Flexibility Selective Soldering Machine

New Equipment | Selective Soldering

For flexible miniwave soldering processes and dip soldering processes that guarantee short cycle times.  The high-end system which leaves nothing to be desired. Maximum Power for Your Selective Production. SEHO PowerSelective is featured with an ou

SEHO Systems GmbH

Henkel Surface Mount Adhesives

Henkel Surface Mount Adhesives

New Equipment | Materials

As the first commercially available adhesive to address the emerging surface-mount market in the 1980s, Loctite Chip bonder and Eccobond products today are the industry standard for mixed-technology and double-sided surface mount technology (SMT) app

Henkel Electronic Materials

Quik-Tool - Automatic PCB Support Tooling

Quik-Tool - Automatic PCB Support Tooling

New Equipment | Other

Quik-tool Automatic PCB Support Tooling is the ideal choice for manufacturers requiring quick and accurate support tool changeover for their PCB production. With Quik-tool, what used to take 10-20 minutes is now accomplished in under 30 seconds. Ma

Quik-tool, LLC

DEK Stinger - Onboard Dispense Module

DEK Stinger - Onboard Dispense Module

New Equipment | Dispensing

Stinger is a low volume dispense module attached to the camera carriage of a standard DEK printer (as an optional extra). It is not designed to replace a regular dispenser but to provide dual functionality to the print platform for customers who requ

ASM Assembly Systems (DEK)

EP-837 Two-part Epoxy Staking Adhesive

EP-837 Two-part Epoxy Staking Adhesive

New Equipment | Materials

6 hours Thin Film Set Time (.001" @ 25°C) >12 hours Total % NV Solids 100% Hegman Gauge Volume Resi

Conductive Compounds, Inc.

ARQ Electronics Manufacturing Services, Inc.

New Equipment |  

ARQ Electronics provides pre-manufacturing, manufacturing and post-manufacturing services primarily associated with mixed-technology, surface-mount (SMT) and throught-hole (PTH) printed circuit assemblies (PCAs). Our focus is on high-quality, respon

ARQ Electronics Manufacturing Services, Inc.

Boundary Scan PXI Modules

Boundary Scan PXI Modules

New Equipment | Other

In the recent years, PXI has established its position in the test and measurement industry, especially with such features as high data transfer rates, small rugged industrial footprint, open standard and multiple vendors. PXI (PCI eXtensions for Inst

GOEPEL Electronic


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