The MVP Selecta is a new product designed to complement your selective solder system and allows you to inspect the components soldered by your bottom-side soldering solution. MVP’s Selecta allows for full bottom-side inspection of all wave and reflow
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The patented technology control system of Z axis AOI can inspect component side of PTH technology. Simpler debugging algorithm, make the programming easier and easy to learn. shift of two sides of board (components top and bottom), auto software or
Phoenix HDI AOI for HDI and multi-layer PCB with min line/space down to 30 µm. Phoenix HDI, CIMS latest generation of AOI system, is designed to support high volume manufacturing of HDI and multi-layer PCB. It is capable to scan down to 30 &
Phoenix Turbo AOI for HDI and multi-layer PCB with min line/space down to 25 µm. Phoenix Turbo, CIMS latest generation of AOI system, is designed to support high volume manufacturing of HDI and high-end multi-layer PCB. It is capable to scan
Phoenix FLEX/Turbo AOI for inspection of flex and rigid-flex with min line/space down to 25 µm. Phoenix FLEX/Turbo, CIMS latest generation of AOI system, is designed to support high volume manufacturing of flex and rigid-flex PCB. It is capa
Phoenix FLEX/HDI AOI for inspection of flex and rigid-flex with min line/space down to 30 µm. Phoenix FLEX/HDI, CIMS latest generation of AOI system, is designed to support high volume manufacturing of flex and rigid-flex PCB. It is capable
Phoenix R2R/Turbo AOI for inspection of FPC in roll-to-roll process with min line/space down to 25 µm. Phoenix R2R/Turbo, CIMS latest generation of AOI system, is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PC
Phoenix R2R/HDI AOI for inspection of FPC in roll-to-roll process with min line/space down to 30 µm. Phoenix R2R/HDI, CIMS latest generation of AOI system, is designed to support roll-to-roll (R2R) manufacturing of flex and rigid-flex PCB. I
Phoenix LV series AOI for laser via inspection with min diameter down to 15 µm. Phoenix LV series, CIMS latest generation of AOI system, is designed to support inspection of laser via in high volume manufacturing of HDI or IC Substrates. It
Phoenix MDI AOI for inspection of mechanical drills down to 150 µm in diameter. Phoenix MDI, CIMS latest generation of AOI system, is designed for inspection of mechanical drills on HDI and multi-layer PCB. It is capable to scan mechanical d
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